Datasheet

MIC2915X/30X/50X/75X
DS20005685B-page 8  2016-2019 Microchip Technology Inc.
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters Sym. Min. Typ. Max. Units Conditions
Temperature Ranges
Storage Temperature Range T
S
–65 — +150 °C —
Operating Junction Temperature T
J
–40 — +125 °C —
Lead Temperature — — — +260 °C Soldering, 5 sec.
Package Thermal Resistance
Thermal Resistance TO-220 θ
JC
—2 —°C/W—
Thermal Resistance TO-263 θ
JC
—2 —°C/W—
Thermal Resistance TO-247 θ
JC
—1.5 —°C/W—
Thermal Resistance TO-252 θ
JC
—3 —°C/W—
Thermal Resistance TO-252 θ
JA
—56 —°C/W—
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., T
A
, T
J
, 
JA
). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.