Datasheet

 2007-2019 Microchip Technology Inc. DS30009905F-page 311
PIC24FJ256GA110 FAMILY
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1.
2.
3.
Notes:
Pin 1 visual index feature may vary, but must be located within the hatched area.
Package is saw singulated
Dimensioning and tolerancing per ASME Y14.5M
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
0.500.30 0.40Contact Length L
Contact-to-Exposed Pad K -0.20 -
Overall Height
Overall Length
Exposed Pad Width
Contact Thickness
Number of Pins
Contact Width
Exposed Pad Length
Overall Width
Standoff
Pitch
E2
D2
b
D
A3
E
A1
7.257.05 7.15
9.00 BSC
0.25
7.157.05
0.18
7.25
0.30
0.02
9.00 BSC
0.20 REF
0.00 0.05
Dimension Limits
e
A
N
Units
MAX
MIN NOM
0.50 BSC
0.90
64
0.80 1.00
MILLIMETERS
Microchip Technology Drawing C04-149D [MR] Sheet 2 of 2
64-Lead Very Thin Plastic Quad Flat, No Lead Package (MR) – 9x9x0.9 mm Body [VQFN]
With 7.15 x 7.15 Exposed Pad [Also called QFN]