Datasheet

 2010 - 2015 Microchip Technology Inc. DS00001692C-page 41
USB251xB/xBi
Note 6-3 Output leakage is measured with the current pins in high impedance.
Note 6-4 See USB 2.0 Specification [1] for USB DC electrical characteristics.
O12, I/O12 & I/OSD12 Type Buffer
Low Output Level V
OL
0.4 V I
OL
= 12 mA @
VDD33 = 3.3 V
High Output Level V
OH
2.4 V I
OH
= -12 mA @
VDD33 = 3.3 V
Output Leakage I
OL
-10 +10 A
Hysteresis (SD pad only) I
HYSC
250 350 mV V
IN
= VDD33
(Note 6-1)
TABLE 6-2: SUPPLY CURRENT UNCONFIGURED: HI-SPEED HOST (I
CCINTHS
)
Part MIN TYP MAX Units Comments
USB2512B/12Bi 40 45 mA
USB2513B/13Bi 40 45 mA
USB2514B/14Bi 45 50 mA
TABLE 6-3: SUPPLY CURRENT UNCONFIGURED: FULL-SPEED HOST (I
CCINTFS
)
Part MIN TYP MAX Units Comments
USB2512B/12Bi 35 40 mA
USB2513B/13Bi 35 40 mA
USB2514B/14Bi 35 40 mA
TABLE 6-4: SUPPLY CURRENT CONFIGURED: HI-SPEED HOST (I
HCH1
)
Part MIN TYP MAX Units Comments
USB2512B 60 65 mA
This is the base current
of one downstream port.
USB2512Bi 60 70 mA
USB2513B 65 70 mA
USB2513Bi 65 75 mA
USB2514B 70 80 mA
USB2514Bi 70 85 mA
USB251xB/xBi
Supply Current Configured
Hi-Speed Host, each additional downstream port
1 port
base
+
25 mA
1 port
base
+
25 mA
mA
TABLE 6-1: DC ELECTRICAL CHARACTERISTICS (CONTINUED)
Parameter Symbol MIN TYP MAX Units Comments