Specifications

The Patent Office Journal 17/12/2010
4525
(12) PATENT APPLICATION PUBLICATION (21) Application No.3830/CHENP/2010 A
(19) INDIA
(22) Date of filing of Application :21/06/2010 (43) Publication Date : 17/12/2010
(54) Title of the invention : COPPER-NICKEL-SILICON ALLOYS
(51) International classification :C22C9/06
(31) Priority Document No :61/016,441
(32) Priority Date :21/12/2007
(33) Name of priority country :U.S.A.
(86) International Application No
Filing Date
:PCT/US08/087705
:19/12/2008
(87) International Publication No
:WO 2009/082695
A9
(61) Patent of Addition to Application
Number
Filing Date
:NA
:NA
(62) Divisional to Application Number
Filing Date
:NA
:NA
(71)Name of Applicant :
1)GBC METALS, LLC
Address of Applicant :427 NORTH SHAMROCK STREET,
EAST ALTON, ILLINOIS 63024. U.S.A.
2)WIELAND-WERKE AG
(72)Name of Inventor :
1)MUTSCHLER, RALPH A.
2)ROBINSON, PETER, WILLIAM
3)TYLER, DEREK, E.
4)KAUFLER, ANDREA
5)KUHN, HANS, ACHIM
6)HOFMANN, UWE
(57) Abstract :
A copper base alloy having an improved combination of yield strength and electrical conductivity consisting essentially of between
about 1.0 and about 6.0 weight percent Ni, up to about 3.0 weight percent Co, between about 0.5 and about 2.0 weight percent SI,
between about 0.01 and about 0.5 weight percent Mg, up to about 1.0 weight percent Cr, up to about 1.0 weight percent Sn, and up to
about 1.0 weight percent Mn, the balance being copper and impurities, the alloy processed to have a yield strength of at least about
137ksi, and an electrical conductivity of at least about 25% IACS.
No. of Pages : 101 No. of Claims : 31