Specifications

The Patent Office Journal 17/12/2010
4633
(12) PATENT APPLICATION PUBLICATION (21) Application No.3809/KOLNP/2010 A
(19) INDIA
(22) Date of filing of Application :11/10/2010 (43) Publication Date : 17/12/2010
(54) Title of the invention : REFRIGERATION APPARATUS
(51) International classification :F04B 39/00
(31) Priority Document No :2008-070238
(32) Priority Date :18/03/2008
(33) Name of priority country :Japan
(86) International Application No
Filing Date
:PCT/JP2009/001006
:05/03/2009
(87) International Publication No :WO 2009/116239
(61) Patent of Addition to Application
Number
Filing Date
:NA
:NA
(62) Divisional to Application Number
Filing Date
:NA
:NA
(71)Name of Applicant :
1)DAIKIN INDUSTRIES LTD.
Address of Applicant :UMEDA CENTER BUILDING, 4-12,
NAKAZAKI-NISHI 2-CHOME, KITA-KU, OSAKA-SHI,
OSAKA 530-8323, JAPAN.
(72)Name of Inventor :
1)HIDEKI MATSUURA
2)MASARU TANAKA
3)HIDEKI HARA
4)KOUJI SHIBAIKE
5)YOUICHI OHNUMA
(57) Abstract :
In a refrigeration apparatus including a refrigerant circuit in which refrigerant represented by Molecular Formula 1: C3HmFn (note
that "m" and "n" are integers equal to or greater than 1 and equal to or less than 5, and a relationship represented by an expression m +
n = 6 is satisfied) and having a single double bond in a molecular structure, or refrigerant mixture containing the refrigerant is used,
predetermined functional resin components (61, 62, 63, 64, 65) arranged so as to contact refrigerant of the refrigerant circuit (10) are
made of any of polytetrafluoroethylene, polyphenylene sulfide, phenolic resin, polyamide resin, chloroprene rubber, silicone rubber,
hydrogenated nitrile rubber, fluorine-containing rubber, and hydrin rubber.
No. of Pages : 46 No. of Claims : 14