Information

Description STM32F20xxx 14/178 DocID15818 Rev 11
Comm. interfaces
SPI/(I
2
S) 3 (2)
(2)
I
2
C 3
USART
UART
4
2
USB OTG FS Yes
USB OTG HS Yes
CAN 2
Camera interface Yes
GPIOs 82 114 140
SDIO Yes
12-bit ADC
Number of channels
3
16 24 24
12-bit DAC
Number of channels
Yes
2
Maximum CPU frequency 120 MHz
Operating voltage 1.8 V to 3.6 V
(3)
Operating temperatures
Ambient temperatures: –40 to +85 °C/–40 to +105 °C
Junction temperature: –40 to + 125 °C
Package LQFP100 LQFP144
LQFP176/
UFBGA176
1. For the LQFP100 package, only FSMC Bank1 or Bank2 are available. Bank1 can only support a multiplexed NOR/PSRAM memory using the NE1 Chip Select. Bank2 can
only support a 16- or 8-bit NAND Flash memory using the NCE2 Chip Select. The interrupt line cannot be used since Port G is not available in this package.
2. The SPI2 and SPI3 interfaces give the flexibility to work in an exclusive way in either the SPI mode or the I2S audio mode.
3. On devices in WLCSP64+2 package, if IRROFF is set to V
DD
, the supply voltage can drop to 1.7 V when the device operates in the 0 to 70 °C temperature range using an
external power supply supervisor (see Section 3.16).
Table 3. STM32F207xx features and peripheral counts (continued)
Peripherals STM32F207Vx STM32F207Zx STM32F207Ix