MK01 Bluetooth Module Datasheet Bluetooth® Module Datasheet
Contents 1. Product Instruction 3 1.1 Model Classification 3 1.2 Key Features 4 1.3 Applications 5 1.4 Product Specifications 6 2. Circuit Design 8 2.1 Block Diagram 8 2.2 Schematic 9 2.3 Reference Circuitry10 2.3.1 DC/DC regulator setup 10 2.3.2 External 32.768 kHz crystal 11 3. Mechanical specifications 12 3.1 Module Mechanical Dimensions 3.2 Recommended PCB land pads 13 4 Pin Assignment 14 5. Mounting Suggestion 17 6. Cautions 20 6.
6.2 Usage Condition Notes22 6.3 Storage Notes 23 6.4.FCC Statement 6.
1. Product Instruction MK01 is a powerful, highly flexible, ultra low power Bluetooth® 5 module based on Nordic® Semiconductor nRF52832 SoC solution, which has a 32 bit Arm® Cortex™M4 CPU with floating point unit running at 64 MHz. MK01 module is multiprotocol capable with full protocol concurrency. It supports BLE® (Bluetooth Low Energy), including the high-speed 2 Mbps feature.
1.2 Key Features Bluetooth 5 o 2Mbps o CSA#2 o Advertising Extensions Sensitivity o o -89 dBm Bluetooth LE 2 Mbps o o -30 dBm whisper mode Supports 2 Mbps Bluetooth LE modes Wide supply voltage range: 1.7 V to 3.
Individual power management for all peripherals Default internal LDO regulator setup (Support DC/DC regulator) 4 32.768 kHz +/-250 ppm RC oscillator5 Dimension: 10.0x10.0x2.0mm (with shield) 22 GPIOs (including 32.768 kHz crystal and reset pins) Firmware: The module can be programmed with MOKO Bluetooth 4.2 master and slave role in one firmware6 or customer specified firmware 1.
1.4 Product Specifications Detail Description Bluetooth Bluetooth 5.
RX only (DCDC enabled, 3V) @2Msps / 2Msps BLE RX only @ 2Msps / 2Mbps BLE System OFF mode（3V） System OFF mode with full 64 kB RAM retention（3V） 5.8mA 12.9mA 0.3uA 0.7uA System ON mode, no RAM retention, wake on RTC 1.9uA （3V） Mechanical Design Dimensions Length: 10mm±0.2mm； Width: 10mm±0.2mmHeight: 2.0mm+0.1mm/-0.
PDM NFC-A Power supply Operating temperature range 1.7V to 3.6V -40 to 85 ℃ 2. Circuit Design 2.1 Block Diagram Module default design is using "Internal LDO regulator setup" and "Internal 32.768 kHz RC oscillator". 2.
MK01B 2.
2.3.1 DC/DC regulator setup When using DC-DC mode, please add L1 / L2. DEC4 decoupling capacitor (1F) is already inside the module. Designator Value Description L1 10H Chip inductor, IDC,min = 50 mA, ±20% L2 15nH High frequency chip inductor ±10% 2.3.2 External 32.768 kHz crystal When using external 32.768 kHz crystal oscillator, please add X2 / C1 / C2. Designator Value X2 32.768 kHz XTAL SMD, 32.768 kHz, CI=9 pF, ±50 ppm C1, C2 12 pF Capacitor, NP0, ±2% 2.3.
When using NFC-A tag , please add C_tune1 and C_tune2. When using NFC-A tag. You should use a NFC Tag antenna coil that must be connected differential between NFC1 and NFC2 pins of the device. The value of C_tune1 and C_tune2 must be tuned to match the selected NFC antenna. The two external capacitors should be used to tune the resonance of the antenna circuit to 13.56 MHz.
3. Mechanical specifications 3.1 Module Mechanical Dimensions MK01 Dimension Symbol Min. Typ. Length -0.2mm 10mm +0.2mm Width -0.2mm 10mm +0.2mm Height(PCB only) -0.08mm 0.8mm +0.08mm Height(with shield) -0.15mm 2.0mm +0.1mm 3.2 Recommended PCB land pads Max.
MK01 PCB land pads(Top View) Symbol Typ. LGA Pad(small) 0.4mm x 0.4mm LGA Pad(big) 0.8mm x 0.
4 Pin Assignment Pin No. Name Type Description nRF52 port 1 P0.19 Digital I/O General purpose I/O P0.19 2 P0.20 Digital I/O General purpose I/O P0.20 TRACECLK 3 P0.18 TRACEDATA[0] 4 Trace port clock output Digital I/O General purpose I/O P0.18 Trace port output P0.10 Digital I/O General purpose I/O 7 NFC2 NFC input NFC antenna connection P0.09 Digital I/O General purpose I/O 7 NFC1 NFC input NFC antenna connection 6 P0.08 Digital I/O General purpose I/O P0.08 7 P0.
8 P0.05 AIN3 9 P0.00 XL1 10 P0.01 XL2 Digital I/O General purpose I/O Analog input SAADC/COMP/LPCOMP input Digital I/O General purpose I/O Analog input input P0.00 Connection for 32.768 kHz crystal (LFXO) Digital I/O General purpose I/O Analog P0.05 P0.01 Connection for 32.768 kHz crystal (LFXO) 1.3 V regulator supply decoupling 11 DEC4 Power Input from DC/DC converter. Output from DEC4 1.3 V LDO 12 GND Power Electrical Ground VSS Power supply. An internal 4.
Analog AIN2 input SAADC/COMP/LPCOMP input 19 P0.25 Digital I/O General purpose I/O 8 P0.25 20 GND Power Electrical Ground VSS 21 GND Power Electrical Ground VSS 22 P0.21 Digital I/O General purpose I/O RESET 23 Configurable as pin reset P0.14 Digital I/O General purpose I/O TRACEDATA[3] 24 P0.15 Digital I/O General purpose I/O P0.16 Digital I/O General purpose I/O Serial wire debug clock input for debug and SWDCLK Digital input 27 SWDIO Digital I/O 28 P0.
You can refer to the following references for the mounting design of the module with on-board antenna (MK01A with ceramic chip antenna on PCB). For external antenna modules (MK01B needs to connect an external antenna to the u.FL connector), you need to refer to the external antenna design requirements.
to inner GND plane. If GND flood copper underside the module then connect with GND vias to inner GND plane. Even when above mentioned condition is satisfied, communication performance may be significantly deteriorated depending on the structure of the product. Bluetooth range performance is degraded if a module is placed in the middle of the main board. For main board layout: o Avoid running any signal line below module whenever possible. o No ground plane below antenna.
Placement of metal parts Minimum safe distance for metal parts without seriously compromising the antenna (tuning) is 40 mm top/bottom and 30 mm left or right. Metal close to the module antenna (bottom, top, left, right, any direction) will have degradation on the antenna performance. The amount of that degradation is entirely system dependent, meaning you will need to perform some testing with your host application.
Reflow soldering is a vitally important step in the SMT process. The temperature curve associated with the reflow is an essential parameter to control to ensure the correct connection of parts. The parameters of certain components will also directly impact the temperature curve selected for this step in the process. Temperature-Time Profile for Reflow Soldering The standard reflow profile has four zones: ①preheat, ②soak, ③reflow and ④cooling.
Time Above Liquidous 45 - 90 s Reflow Temperature 230 - 250 °C Absolute Peak Temperature 260 °C Example of MOKO SMT reflow soldering Note: The module is LGA package. Please be careful of the amount of solder paste. The module may be lifted due to excess solder. 6.2 Usage Condition Notes Follow the conditions written in this specification, especially the recommended condition ratings about the power supply applied to this product.
Take measures to protect the unit against static electricity. If pulses or other transient loads (a large load applied in a short time) are applied to the products, check and evaluate their operation before assembly on the final products. The supply voltage should not be exceedingly high or reversed. It should not carry noise and/or spikes. This product away from other high frequency circuits. Keep this product away from heat. Heat is the major cause of decreasing the life of these products.
6.4.FCC Statement 1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: This device may not cause harmful interference. This device must accept any interference received, including interference that may cause undesired operation. 2. Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.
This device must accept any interference,including interference that may cause undesired operation of the device - French: Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
