Data Sheet

Reflow soldering is a vitally important step in the SMT process. The temperature
curve associated with the reflow is an essential parameter to control to ensure the
correct connection of parts. The parameters of certain components will also directly
impact the temperature curve selected for this step in the process.
Temperature-Time Profile for Reflow Soldering
 The standard reflow profile has four zones: ①preheat, ②soak, ③reflow and
④cooling. The profile describes the ideal temperature curve of the top layer of
the PCB.
 During reflow, modules should not be above 260° and not for more than 30
seconds.
Specification
Value
Unit
Temperature Increase Rate
＜2.5
°C / s
Temperature Decrease Rate
Free air cooling
-
Preheat Temperature
0 - 150
°C
Preheat Period (Typical)
40 - 90
s
Soak Temp Increase Rate
0.4 - 1
°C / s
Soak Temperature
150 - 200
°C
Soak Period
60 - 120
s
Liquidus Temperature (SAC305)
220
°C