Data Sheet

MK07 Bluetooth Module

Datasheet

www.mokoblue.com

7. Cautions

7.1 Reflow Soldering

Reflow soldering is a vitally important step in the SMT process. The temperature curve associated

with the reflow is an essential parameter to control to ensure the correct connection of parts. The

parameters of certain components will also directly impact the temperature curve selected for this

step in the process.

Temperature-Time Profile for Reflow Soldering:

• The standard reflow profile has four zones: ①preheat, ②soak, ③reflow, ④cooling. The

profile describes the ideal temperature curve of the top layer of the PCB.

• During reflow, modules should not be above 260°C and not for more than 30 seconds.

Specification

Value

Temperature Increase Rate

<2.5°C/s

Temperature Decrease Rate

Free air cooling

Preheat Temperature

0-150°C

Preheat Period (Typical)

40-90s

Soak Temp Increase Rate

0.4-1°C/s

Soak Temperature

150-200°C

Soak Period

60-120s

Liquidus Temperature (SAC305)

220°C

Time Above Liquidous

45-90s

Reflow Temperature

230-250°C

Absolute Peak Temperature

260°C