Data Sheet

MK07 Bluetooth Module

Datasheet

www.mokoblue.com

Example of MOKO SMT reflow soldering:

Note: The module is LGA package. Please be careful of the amount of solder paste. The

module may be lifted due to excess solder.

7.2 Usage Condition Notes

• Follow the conditions written in this specification, especially the recommended condition

ratings about the power supply applied to this product.

• The supply voltage has to be free of AC ripple voltage (for example from a battery or a low

noise regulator output). For noisy supply voltages, provide a decoupling circuit (for example a

ferrite in series connection and a bypass capacitor to ground of at least 47uF directly at the

module).

• Take measures to protect the unit against static electricity. If pulses or other transient loads (a

large load applied in a short time) are applied to the products, check and evaluate their

operation before assembly on the final products.

• The supply voltage should not be exceedingly high or reversed. It should not carry noise

and/or spikes.

• This product away from other high frequency circuits.

• Keep this product away from heat. Heat is the major cause of decreasing the life of these

products.

• Avoid assembly and use of the target equipment in conditions where the products’

temperature may exceed the maximum tolerance.

• This product should not be mechanically stressed when installed.

• Do not use dropped products.

• Do not touch, damage or soil the pins.

• Pressing on parts of the metal shield or fastening objects to the metal shield will cause

damage.