User's Guide

MM6108-MF08251 User Guide UG100
IEEE 802.11ah Sub-1G Wi-Fi HaLow Module
Page 17/19
7. Part Number and Ordering Information
7.1. Part Ordering Information
Part Number
Packing Type
Pins
Size (mm)
Description
MM6108-MF08251
Tray
38
14.0 x 18.5 x 2.1
IEEE 802.11ah Sub-1 GHz 1/2/4/8 MHz
Wi-Fi HaLow Module
8. Handling and Storage
The MM610x-MF08251 class of modules are a moisture sensitive device rated at Moisture
Sensitive Level 3 (MSL3) per IPC/JEDEC J-STD-20.
After opening the moisture sealed storage bag, modules that will be subjected to reflow solder
or other high temperature processes must be:
1. Mounted to a circuit board within 168 hours at factory conditions (≤30°C and <60% RH)
OR
2. Continuously stored per IPC/JEDEC J-STD-033
Modules that have been exposed to moisture and environmental conditions exceeding
packaging and storage conditions MUST be baked before mounting according to IPC/JEDEC
J-STD-033. Failure to meet packaging and storage conditions will result in irreparable damage
to modules during solder reflow.