Service manual

68P80401P01-O 1
CHAPTER 9
MECHANICAL PARTS REWORK AND REPAIR
The following section details the equipment and procedures needed to correctly remove and replace
specific Main Board components on the i870.
9.1 Recommended Equipment
9.1.1 Hot Air Machine
Pace ThermoFlo 200 or similar.
9.1.2 Pre-heater
X-Kar 1000-S or similar.
9.1.3 High Performance Soldering Station
Pace HeatWise 200 with thermal recovery system or similar.
1. .6mm (0.06”) CHISEL (P/N1124-0019-P1) to fill lands (Big) during Land Preparation
procedure.
2. 0.40mm (0.016”) 1/64” 60° BEVEL (P/N1124-0011-P1) to fill/level lands (Big) during Land
Preparation procedure.
3. 10.80mm (.425”) BLADE (P/N1124-0501-P1) to wick off or level solder (BGAs) during Land
Preparation procedure.
9.1.4 Microscope
Leica Stereozoom 6 or similar.
9.1.5 Magnifier Lamp
5-diopter magnifier lamp.
9.1.6 Fume Absorber
Pace Arm-Evac 200 or similar.
9.2 Recommended Tools
9.2.1 Nozzles
• N-Q07