- Texas Instruments Floating Point Digital Signal Processor Specification Sheet

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SPRS292A − OCTOBER 2005 − REVISED NOVEMBER 2005
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device and development-support tool nomenclature (continued)
PREFIX
DEVICE SPEED RANGE
TMS 320 C 6711D GDP 250
TMX= Experimental device
TMP= Prototype device
TMS= Qualified device
SMJ = MIL-PRF-38535, QML
SM = High Rel (non-38535)
DEVICE FAMILY
32 or 320 = TMS320 DSP family
TECHNOLOGY
PACKAGE TYPE
†‡§
C = CMOS
DEVICE
†
BGA = Ball Grid Array
‡
The ZDP mechanical package designator represents the version of the GDP with Pb−Free soldered balls. The ZDP package devices
are supported in the same speed grades as the GDP package devices (available upon request).
§
For actual device part numbers (P/Ns) and ordering information, see the Mechanical Data section of this document or the
TI website (www.ti.com).
TEMPERATURE RANGE (DEFAULT: 0°C TO 90°C)
( )
Blank = 0°C to 90°C, commercial temperature
A = −40°C to 105°C, extended temperature
167 MHz
200 MHz
250 MHz
GDP = 272-pin plastic BGA
ZDP = 272-pin plastic BGA, with Pb-free soldered balls
C6711D
Figure 5. TMS320C6711D DSP Device Nomenclature
MicroStar BGA and PowerPAD are trademarks of Texas Instruments.