Datasheet

Intel
®
815E Scalable Performance Board Development Kit Manual 67
Bill of Materials
Y2 X’TAL KDS 32.768KHZ
EPSON
32.768KHZ,
CITIZEN
32.768KHZ
DIMM1,DIMM2,DIMM3 SOCKET MOLEX
DIMM
UNBUFFERED
168PIN 3.3V
NYLON
FOXCONN
DIMM
UNBUFFERED
168PIN 3.3V,
TEKCON DIMM
UNBUFFERED
168PIN 3.3V
NYLON
U3 SOCKET FOXCONN
370 PIN
ZIF(ANTI-
FLUX)NEW
AMP 370 PIN
ZIF
U23 SOCKET FOXCONN 32 PIN
SP1 BUZZER HYPAK KC-1206
U7 HEAT SINK AAVID
37.4*37.4*9.8mm
+LATCH GREEN
SW1 DIP SWITCH 8*2 PIN
JP1(1-2) JUMPER 2PIN (BLACK)
BAT1
BATTERY
SOCKET
LOTES
D16 LED RED
S1,JP3 HEADER 2*1 PIN
JP1 HEADER 3*1 PIN
WOL1 HEADER
WAFER WOL
3*1PIN PITCH
2mm
AUX1,CD2 HEADER
WAFER
4*1PIN(CD-IN)
JP4 HEADER
5*1 PIN(CUT
PIN1)
IR1,SMB1,SMB2,JP5 HEADER 5*1 PIN
USB2 HEADER
5*2 PIN CUT PIN
1,2
COM2 HEADER 5*2 PIN
PN1 HEADER
14x1 PIN w/ No.
6,9,12 MISSING
PN2 HEADER
14x1 PIN w/ No.
3,8,11 MISSING
FDC1 HEADER WAFER 17*2 PIN
VL1 HEADER 20*2PIN(F)
Table 22. Bill of Materials (Sheet 3 of 10)
Rev. 1.1
Reference
Designator
Description Manufacturer
Manuf. Part
Number
Alternate
Manufacturing
Info
All
Changes