Datasheet

74 Intel
®
815E Scalable Performance Board Development Kit Manual
Bill of Materials
EC3,EC26,EC27,EC28,
EC33,EC35,EC36,
E/C TAYEH 22UF/16V (4*7)
JACKCON
22UF/16V (4*7)
EC5,EC10,EC15,EC17,
EC18,EC19,
E/C TAYEH
100UF/16V
(6.3*7)
JACKCON
100UF/16V
(6*7)
EC22,EC30,EC39,C77,
C78
C6 T/C SPRAGUE 33UF/20V "D"
EC1,EC2,EC4,EC7,EC
8,EC9,EC12,EC13,
E/C TAYEH
1500UF/
6.3V(8*16)
EC14,EC21,EC23,EC2
4,EC25,EC29,
E/C JACKCON
1500UF/
6.3V(8*16)
EC31,EC32,EC34,C32 E/C JPCON
1500UF/6.3V
(8*16)
L3 INDUCTOR GLOMAG
IRON COIL
1UH(50MB)
L1 INDUCTOR GLOMAG
IRON COIL
2.5UH(5052)
L2 INDUCTOR MURATA 4.7UH (0805)
L4 INDUCTOR GLOMAG
IRON COIL
7UH(5052B)
F1,F2,F4,F5,F6,F7 FUSE BOURNS
POLY S/W
MSMC110-2
RAYCHEM
POLY S/
WSMDC100
FB1,FB2,FB3,FB4,FB5,
FB6,FB8,FB11,
INDUCTOR TAIYO
BEAD 241/
100MHZ (0805)
LL241
EMC BEAD
221/100MHZ
(0805)
FB12,FB13,FB14,FB15,
FB16,FB17,
FB19-FB29
VFB1,VFB2,VFB3,PFB
1,PFB2,PFB4,
INDUCTOR MURATA
BEAD
BLM11B750SPT(
0603)
PFB5,PFB6,PFB11,PF
B12,
U23
CHIPSET
(FWH)
INTEL N82802AC8
Table 22. Bill of Materials (Sheet 10 of 10)
Rev. 1.1
Reference
Designator
Description Manufacturer
Manuf. Part
Number
Alternate
Manufacturing
Info
All
Changes