Data Sheet
Table Of Contents
- Revision History
- Table of Contents
- 1 Introduction
- 2 Mechanical Specification
- 3 DC Electrical Specification
- 4 RF Specification
- 5 Environmental Specification
- 6 Power Sequence
- 7 Application Information
- 8 Application Reference
- 9 Assembly Information
- 10 Packaging and Marking Information
- 11 Regulatory Information
- 12 RoHS Information
- 13 Ordering Information
- 14 Notice
- 15 Preconditions To Use Murata Products
Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2017
MBN52832 Data Sheet, v1.3, 11/13/2018 Page 18 of 34 www.murata.com
Figure 8.5 Layout Guide for External Antenna (1)
The design of the 50 ohm microstrip on the customer’s PCB is crucially important. Compliant operation of the MBN is
dependent on proper construction of this 50 ohm line and the following guidelines must be followed to ensure legal operation
of the product.
The diagram below shows the required microstrip structure to be routed between module pin TP21 and the UFL connector.
The top PCB trace carries the RF energy from module to UFL connector. The Layer2 ground plane provides a return path
for the circuit. The Dielectric material (along with the dimensions of the microstrip structures) determines the characteristic
impedance of the microstrip transmission line.
Figure 8.6 Layout Guide for External Antenna (2)
Note the representative dimensions shown in the drawing above. It is imperative that the module customer (the integrator)
use the exact dimensions we recommend to ensure a 50-ohm impedance for this transmission line.
The following dimensions and/or ratios should be used to set the microstrip impedance to 50 ohms.
Dielectric (PCB) Material – We recommend standard FR-4 PCB material. Other dielectrics will work but will require
recalculation of microstrip dimensions. The following guidance is predicated on the use of FR-4 Dielectric. If FR-4 is not
used for PCB material, please contact Murata Electronics at (678) 684-2009 to determine new dimensions for microstrip
structure.
H (Dielectric Height) – this is the thickness of dielectric between the trace layer (layer 1) and the ground plane on layer 2.
Note that layer 2 must be electrical ground. We recommend a dielectric thickness of 8-15 mils. This range provides the
customer with some flexibility in board construction.
t (trace thickness) – Microstrip impedance is not severely affected by the thickness dimension. Standard 1oz or 2oz copper
deposition is recommended. Equivalent thickness is 1-2 mils.
W (trace width) – this is the crucial dimension. This width must be set correctly to obtain the desired 50 ohms impedance.
When using FR-4 dielectric, the width (W) of the microstrip trace should be set to: