Data Sheet
Table Of Contents
- Revision History
- Table of Contents
- 1 Introduction
- 2 Mechanical Specification
- 3 DC Electrical Specification
- 4 RF Specification
- 5 Environmental Specification
- 6 Power Sequence
- 7 Application Information
- 8 Application Reference
- 9 Assembly Information
- 10 Packaging and Marking Information
- 11 Regulatory Information
- 12 RoHS Information
- 13 Ordering Information
- 14 Notice
- 15 Preconditions To Use Murata Products
Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2017
MBN52832 Data Sheet, v1.3, 11/13/2018 Page 32 of 34 www.murata.com
14 Notice
14.1 Storage Conditions
Please use this product within 6month after receipt.
- The product shall be stored without opening the packing under the ambient temperature from 5 to 35deg.C and humidity
from 20 to 70%RH.
(Packing materials, in particular, may be deformed at the temperature over 40deg.C.)
- The product left more than 6months after reception, it needs to be confirmed the solderbility before used.
- The product shall be stored in non-corrosive gas (Cl2, NH3, SO2, Nox, etc.).
- Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp object and dropping
the product, shall not be applied in order not to damage the packing materials.
This product is applicable to MSL3 (Based on JEDEC Standard J-STD-020)
- After the packing opened, the product shall be stored at <30deg.C / <60%RH and the product shall be used within
168hours.
- When the color of the indicator in the packing changed, the product shall be baked before soldering.
Baking condition: 125+5/-0deg.C, 24hours, 1time
The products shall be baked on the heat-resistant tray because the material (Base Tape, Reel Tape and Cover Tape) are
not heat-resistant.
14.2 Handling Conditions
Be careful in handling or transporting products because excessive stress or mechanical shock may break products.
Handle with care if products may have cracks or damages on their terminals, the characteristics of products may change.
Do not touch products with bear hands that may result in poor solder ability and destroy by static electrical charge.
14.3 Standard PCB Design (Land Pattern and Dimensions)
All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern should be provided
between IN and OUT terminals. Please refer to the specifications for the standard land dimensions.
The recommended land pattern and dimensions is as Murata's standard. The characteristics of products may vary
depending on the pattern drawing method, grounding method, land dimensions, land forming method of the NC terminals
and the PCB material and thickness. Therefore, be sure to verify the characteristics in the actual set. If use non-standard
lands, contact Murata beforehand.
14.4 Notice for Chip Placer
When placing products on the PCB, products may be stressed and broken by uneven forces from a worn-out chucking
locating claw or a suction nozzle. To prevent products from damages, be sure to follow the specifications for the
maintenance of the chip placer being used. For the positioning of products on the PCB, be aware that mechanical
chucking may damage products.
14.5 Operational Environment Conditions