Datasheet

LXDC55KAAA-205

Micro DC-DC converter

Dec 2014

NOTICE

1. Storage Conditions:

・The product shall be stored without opening the packing under the ambient temperature from 5 to 35 deg.C

and humidity from 20 to 70%RH.

(Packing materials, in particular, may be deformed at the temperature over 40 deg.C.)

・The product left more than 6 months after reception, it needs to be confirmed the solderbility before used.

- The product shall be stored in non corrosive gas (Cl

, NH

, SO

, No

, etc.).

- Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp object

and dropping the product, shall not be applied in order not to damage the packing materials.

・After the packing opened, the product shall be stored at <

30 deg.C / < 60 %RH and the product shall be

used within 168 hours.

When the color of the indicator in the packing changed, the product shall be baked before

soldering.

This product is applicable to MSL3 (Based on IPC/JEDEC J-STD-020)

2. Handling Conditions:

Be careful in handling or transporting the product. Excessive stress or mechanical shock may damage the

product because of the nature of ceramics structure.

Do not touch the product, especially the terminals, with bare hands. Doing so may result in poor

solderability.

3. Standard PCB Design (Land Pattern and Dimensions):

All the ground terminals should be connected to ground patterns. Furthermore, the ground pattern

should be provided between IN and OUT terminals. Please refer to the specifications for the standard

land dimensions.

The recommended land pattern and dimensions are shown for a reference purpose only.

Electrical, mechanical and thermal characteristics of the product shall depend on the pattern design and

material / thickness of the PCB. Therefore, be sure to check the product performance in the actual set.

When using underfill materials, be sure to check the mechanical characteristics in the actual set.