MBN52832 Data Sheet BLE Module Revision History Revision Date Author Change Description 0.1 06/03/2016 RF PD Preliminary version 0.2 06/16/2016 RF PD Modified the module block diagram. 0.3 8/25/2016 RF PD Update test data points 0.4 8/27/2016 RF PD Update module dimension and reference schematic 0.5 12/15/2016 RF PD Applied model/type name MBN52832 to the datasheet 0.6 02/01/2017 RF PD Update Table 2.1 and Figure 2.2 0.7 03/15/2017 RF PD Add sleep current 0.
Table of Contents REVISION HISTORY .............................................................................................................................................................. 1 TABLE OF CONTENTS ......................................................................................................................................................... 2 1 INTRODUCTION ..............................................................................................................................
11.6.1 Using on-board PCB antenna ..................................................................................................................... 30 11.6.2 Using external antenna ............................................................................................................................... 30 11.7 KC Certificate Notice ................................................................................................................................................
LIST OF FIGURES Figure 1.1 Block Diagram ........................................................................................................................................................ 6 Figure 2.1 Module Top and Side View (Unit: mm) .................................................................................................................. 7 Figure 2.2 Module Footprint Top View (Unit: mm) ........................................................................................................
1 Introduction MBN52832 is a Bluetooth Low Energy module. It enables ultra-low power connectivity for data communication. The product integrates Nordic Bluetooth Low Energy IC, RF front end, and crystal. This is an ideal solution for Internet of Things (IOT) application. 1.
1.3 Block Diagram BLE/ANT Antenna NFC Antenna (Optional) 32MHz X’tal VCC SPI To external or on-board antenna Matching circuit Nordic nRF52832 UART SWD GPIO/AIO 32KHz X’tal (for ANT only Optional) Inductor for DC/DC (optional) Figure 1.1 Block Diagram 1.4 Acronyms - AIO - GPIO - I2C - LPCOMP - SPI - UART 1.
2 Mechanical Specification 2.1 Module Dimensions Table 2.1: Module Dimensions Parameter Dimension (L x W x H) 2.2 Typical 7.4 ±0.2mm x 7.0 ±0.2mm x 0.9 (max) Unit mm Top and Side View 7.4mm typ. Pin 1 0.9mm max. 7.0mm typ. Figure 2.1 Module Top and Side View (Unit: mm) Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.4a, 02/06/2020 Page 7 of 34 www.murata.
2.3 PCB Footprint Top View Figure 2.2 Module Footprint Top View (Unit: mm) Mark L Dimensions 7.4±0.2 Mark W Dimensions 7.0±0.2 Mark T Dimensions 0.9 MAX Mark Dimensions a1 0.3±0.1 a2 0.3±0.1 b1 0.3±0.2 b2 0.425±0.2 b3 0.3±0.2 c1 0.6±0.1 c2 0.6±0.1 e1 0.65±0.1 e2 0.65±0.1 g1 0.35±0.1 g2 0.5±0.1 g3 0.35±0.1 g4 2.6±0.1 m1 0.3±0.1 m2 0.6±0.1 m3 0.3±0.1 m4 0.3±0.1 m5 0.3±0.1 m6 0.6±0.1 s1 0.425±0.2 s2 0.3±0.2 s3 0.475±0.1 s4 0.35±0.1 s5 0.825±0.1 s6 0.
2.4 Pin Configuration Figure 2.3 Pinout Diagram Top View Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.4a, 02/06/2020 Page 9 of 34 www.murata.
Table 2.2 Pinouts Pin # Pin Name 1 P0_09/NFC ANT 2 P0_06 P0_00/XL1 3 4 5 6 7 Nordic IC Pin P0.09/NFC P0.06 P0.00/XL1 I/O I/O I/O I/O Description GPIO; NFC antenna connection. GPIO Connection for 32.768kHz crystal (LFXO); GPIO Connection for 32.768kHz crystal (LFXO); GPIO GND Module power supply DC/DC converter output pin. *Refer to reference schematic. 1V3 regulator supply decoupling. Input from DC/DC converter. Output from 1.3V LDO. *Refer to reference schematic.
Pin # 34 35 36 37 Pin Name GND GND NC NC Nordic IC Pin I/O Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.4a, 02/06/2020 Page 11 of 34 Description Ground. Ground. NC NC www.murata.
3 DC Electrical Specification 3.1 Typical Power Consumption Table 3.1 Typical Power Consumption TX Active @3.5dBm RX Active Sleep Mode LDO mode DCDC mode LDO mode DCDC mode System Off System On with internal RC System On with external 32kHz crystal Current 16 7 14 6 0.36 2.13 1.79 Unit mA mA mA mA uA uA uA 4 RF Specification Conditions: 25ºC, VCC=3.3V, Parameters measured at RF connector. Table 4.
5 Environmental Specification 5.1 Absolute Maximum Rating Table 5.1 Absolute Maximum Rating Description Storage temperature Operating temperature VCC VIO, VDD ≤ 3.6 V VIO, VDD > 3.6 V NFC antenna pin current RF input level 5.2 Min -40 -40 -0.3 -0.3 -0.3 Max +125 85 +3.9 VCC+0.3 3.9 80 10 Unit °C °C V V V mA dBm Recommended Operating Condition Table 5.2 Recommended Operating Condition Parameter Operating Temperature Range VCC Supply rise time (0V to 1.7V) Min -40 1.7 Max 85 3.
7 Application Information 7.1 Recommended PCB Landing Pattern Figure 7.1 Recommended PCB Landing Pattern Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.4a, 02/06/2020 Page 14 of 34 www.murata.
7.2 Host PCB Layout Recommendations Figure 7.2 Host PCB Layout Recommendation, top view Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.4a, 02/06/2020 Page 15 of 34 www.murata.
7.3 Layout Guidance for Using Internal PCB Antenna The MBN52832 module is certified with an internal PCB antenna physically located on the module. For optimum EIRP (Effectively Isotropically Radiated Power) when use the on-board antenna, please follow the following recommendations in the customer host circuit board design. A. The module is recommended is be placed on top left corner of the host circuit board. B.
Figure 7.4 Layout Guide for Antenna Performance (2) The Integrator must place the matching circuit shown below between Pins 20 and 21 of the Module to duplicate the structure used during FCC/IC testing of the MBN52832. Use the exact PNs provided for L1 and C2 to meet regulatory requirements. On the integrator’s support board, place L1 between Pin 20 and Pin 21 of the Module. Place C2 adjacent to Pin 21. The other side of C2 should be attached to RF Ground.
Figure 7.5 Layout Guide for External Antenna (1) The design of the 50 ohm microstrip on the customer’s PCB is crucially important. Compliant operation of the MBN is dependent on proper construction of this 50 ohm line and the following guidelines must be followed to ensure legal operation of the product. The diagram below shows the required microstrip structure to be routed between module pin TP21 and the UFL connector. The top PCB trace carries the RF energy from module to UFL connector.
W = H * 1.8 Where W is microstrip trace width and H is Dielectric height. Note that both values must be measured in identical units (mils or mm) Example: H = 12 mils, W = 12 * 1.8 = 21.6 mils H = 0.4 mm W = 0.4 * 1.8 = 0.72 mm l (trace length) – the impedance of the microstrip line is not dependent on its length. However, regulatory and performance limitations practically determine the actual length to be used by the customer (integrator).
8 Application Reference Notes: Option #1: DC/DC converter: as it is Option #2: LDO: remove L1 and L2 Figure 8.1 Reference Design Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.4a, 02/06/2020 Page 20 of 34 www.murata.
9 Assembly Information The recommendation conditions of soldering are as in the following figure. When products are immersed in solvent after mounting, pay special attention to maintain the temperature difference within 100 °C. Soldering must be carried out by the above mentioned conditions to prevent products from damage. Set up the highest temperature of reflow within 260 °C. Contact Murata before use if concerning other soldering conditions. Reflow soldering standard conditions Figure 9.
10 Packaging and Marking Information 10.1 Dimensions of Tape (Plastic tape) Figure 10.1 Tape Dimensions (Unit in mm) Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.4a, 02/06/2020 Page 22 of 34 www.murata.
10.2 Dimensions of Reel Figure 10.2 Reel Dimensions (Unit: mm) Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.4a, 02/06/2020 Page 23 of 34 www.murata.
10.3 Taping Diagrams [1] Feeding Hole : As specified in (1) [2] Hole for chip : As specified in (1) [3] Cover tape : 62 um in thickness [4] Base tape : As specified in (1) Feeding Hole Feeding Direction Pin 1 Marking Chip Figure 10.3 Tape Diagram Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.4a, 02/06/2020 Page 24 of 34 www.murata.
10.4 Leader and Tail tape Feeding direction Tail tape (No components) Components 40 to 200mm No components 150mm min. Leader tape (Cover tape alone) 250mm min. Figure 10.4 Tape Leader and Tail The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled toward the user. The cover tape and base tape are not adhered at none components area for 250 mm min. Tear off strength against pulling of cover tape: 5 N min. Packaging unit: 1000 pcs.
10.5 Peeling Force 1.3 N max. in the direction of peeling as shown below. 1.3 N max. 165 to 180 ° Cover tape Base tape Figure 10.5 Peeling Force Diagram 10.6 PACKAGE (Humidity proof Packaging) Label 表示ラべル Desiccant 乾燥剤 Humidity 湿度 Indicator インジケ-タ 表示ラベル Label 防湿梱包袋 Anti-humidity Plastic Bag Figure 10.6 Packaging Diagram Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant and the humidity indicator. Copyright © Murata Manufacturing Co., Ltd.
10.7 Module Marking Information Figure 10.7 shows the module marking. Dimensions are nominal, not absolute. Figure 10.7 Module Marking Diagram 10.8 Moisture Sensitivity Level The MBN52832 is planned to be qualified to moisture sensitivity level 3 in accordance with JEDEC J-STD-020. Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2017 MBN52832 Data Sheet, v1.4a, 02/06/2020 Page 27 of 34 www.murata.
11 Regulatory Information The table below shows the regulatory compliance status of the MBN52832 module. Table 11.1 Regulatory Standards Conformance Regulatory Body FCC IC ETSI TELEC KC BT SIG Standard Part 15 RSS-210 EN300 328, Ver. 2.1.1 ETSI EN301.489 - 17 Article 38-24 Paragraph 1 of the Radio Law Non-license based wireless device technical standard (MSIT notice 2019-105) BT 5.
accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Reorient or relocate the receiving antenna.
HG2407RD-RSP L-Comm 7.0 Dipole U.FL DEVIALET Flipper Antenna Devialet 2.2 IFA N/A (Pattern antenna) Necessary for FCC/IC compliance only. Necessary for FCC/IC compliance only. 11.4 IC Labeling Requirements The host device should be properly labeled to identify the module within the host device.
11.7 KC Certificate Notice Certification Number: R-C-VPY-MBN52832 Name of the applicant: Murata Manufacturing Co., Ltd. Name of the equipment name (written in the certification): Specific low power wireless device (wireless device for wireless data communication system) Model name: MBN52832 Date of Certification: February 2020 Manufacturer/The country of origin: Murata Manufacturing Co., Ltd./ China 12 RoHS Information The MBN52832 module is conformed to RoHS requirement.
14 Notice 14.1 Storage Conditions Please use this product within 6month after receipt. - The product shall be stored without opening the packing under the ambient temperature from 5 to 35deg.C and humidity from 20 to 70%RH. (Packing materials, in particular, may be deformed at the temperature over 40deg.C.) - The product left more than 6months after reception, it needs to be confirmed the solderbility before used. - The product shall be stored in non-corrosive gas (Cl2, NH3, SO2, Nox, etc.).
Products are designed to work for electronic products under normal environmental conditions (ambient temperature, humidity and pressure). Therefore, products have no problems to be used under the similar conditions to the abovementioned. However, if products are used under the following circumstances, it may damage products and leakage of electricity and abnormal temperature may occur. - In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.).
15 PRECONDITIONS TO USE MURATA PRODUCTS PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS. Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the specifications of our product when our product is mounted to your product. All the items and parameters in this product specification/datasheet/catalog have been prescribed on the premise that our product is used for the purpose, under the condition and in the environment specified in this specification.