Datasheet

!Note
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
C31E.pdf
Mar.28,2011
Chip Ferrite BeadChip EMIFILr
Chip Common Mode Choke Coil
Block Type EMIFILr
Soldering and Mounting
92
2. Solder Paste Printing and Adhesive Application
When reflow soldering the chip ferrite beads, the printing
must be conducted in accordance with the following
cream solder printing conditions.
If too much solder is applied, the chip will be prone to
damage by mechanical and thermal stress from the PCB
and may crack.
Standard land dimensions should be used for resist and
copper foil patterns.
When flow soldering the chip ferrite beads, apply the
adhesive in accordance with the following conditions.
If too much adhesive is applied, then it may overflow into
the land or termination areas and yield poor solderability.
In contrast, if insufficient adhesive is applied, or if the
adhesive is not sufficiently hardened, then the chip may
become detached during flow soldering process.
BLM
BLM18/21/31/41 Series
(Except BLM18G Series)
Coating amount is illustrated in the
following diagram.
(in mm)
oEnsure that solder is applied smoothly to a
minimum height of 0.2mm to 0.3mm at the end
surface of the part.
oGuideline of solder paste thickness:
50-80µm: BLM02
100-150µm: BLM03
100-200µm: BLM15/18/21/31/41
0.2−0.3mm min.
a: 20−70µm
b: 30−35µm
c: 50−105µm
c
a
b
Chip Solid Inductor
Bonding agent
Land
PCB
BLA
BLA31 Series
Coating amount is illustrated in the
following diagram.
oGuideline of solder paste thickness:
100-150µm: BLA2A
150-200µm: BLA31
a: 20−70µm
b: 30−35µm
c: 50−105µm
c
a
b
Chip Solid Inductor
Bonding Agent
Land
PCB
Series Solder Paste Printing Adhesive Application
(Except BLM
15_AN1 series)
0.4
1.75
0.5 0.5 0.5
1.5
0.8
0.25 0.25
0.80.7 0.7
BLA31 BLA2A
BLp Chip Ferrite Bead Soldering and Mounting
o PCB Warping
PCB should be designed so that products are not
subjected to the mechanical stress caused by warping
the board.
Poor example
Products should be located in the sideways direction
(Length: a<b) to the mechanical stress.
Good example
a
b