Datasheet

!Note
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
C31E.pdf
Mar.28,2011
Chip Ferrite BeadChip EMIFILr
Chip Common Mode Choke Coil
Block Type EMIFILr
Soldering and Mounting
94
4. Cleaning
5. Mounting of BLM15_AN1 Series
BLM15_AN1 is series for wire bonding mounting.
(1) Die Bonding Mounting
(a) Dimension of Standard Metal Mask
(b) Die Bonding Agent
o Use adhesive for die bonding for which the curing
temperature is 200°C or less.
(c) Notice
o Use a flat surface of substrate for bonding mounting.
Slant mounting of product may affect the wire bonding.
o Adhesive for die bonding may affect the mounting
reliability in wire bonding.
Make sure of the mounting reliability with the adhesive to
be used in advance.
0.1-0.5
0.7
Chip Ferrite Bead
Metal thickness: 50µm
(in mm)
Following conditions should be observed when cleaning
chip ferrite beads.
(1) Cleaning Temperature: 60°C max. (40°C max. for
alcohol type cleaner)
(2) Ultrasonic
Output: 20W/liter max.
Duration: 5 minutes max.
Frequency: 28 to 40kHz
(3) Cleaning Agent
The following list of cleaning agents have been tested on
the individual components. Evaluation of final assembly
should be completed prior to production.
(a) Alcohol cleaning agent
Isopropyl alcohol (IPA)
(b) Aqueous cleaning agent
Pine Alpha ST-100S
(4) Ensure that flux residue is completely removed.
Component should be thoroughly dried after aqueous
agent has been removed with deionized water.
(5) BLM_G type is processed with resin. On rinsing the
product, using water for ultrasonic cleaning may affect
the resin quality used for the product by water element. In
case of set cleaning conditions, please make sure the
reliability according to the cleaning conditions.
BLp Chip Ferrite Bead Soldering and Mounting
(3) Reworking with Solder Iron
The following conditions must be strictly followed when
using a soldering iron.(Except BLM02 Series)
Pre-heating: 150°C 60s min.
Soldering iron power output / Tip diameter:
80W max. / ø3mm max.
Temperature of soldering iron tip / Soldering time / Times:
350°C max. / 3-4s / 2 times
Do not allow the tip of the soldering iron to directly
contact the chip.
For additional methods of reworking with a soldering iron,
please contact Murata engineering.