Datasheet

Chip Ferrite BeadChip EMIFILr
Chip Common Mode Choke Coil
Block Type EMIFILrMicrowave Absorber
!Note
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C31E.pdf
09.4.20
126
1. Standard Land Pattern Dimensions
Soldering and Mounting
Chip EMIFILr
Continued on the following page.
NF
p
NFp series suppress noise by conducting the high-frequency noise element to ground. Therefore, to obtain maximum
performance from these filters, the ground pattern should be made as large as possible during the PCB design stage. As
shown below, one side of the PCB is used for chip mounting, and the other is used for grounding.
Small diameter feedthrough holes are then used to connect the grounds on each side of the PCB. This reduces the high-
frequency impedance of the grounding and maximizes the filter's performance.
o Reflow Soldering
NFM21
NFM3D
NFM31P
NFM41
NFR21G
NFL21S
NFM18
NFL18
NFM55P
NFM21C/NFR21G
NFM21P/NFL21S
NFM3DC/NFM3DP
NFM31P
NFM41C/NFM41P
• NFp18, NFM55P are specially adapted for reflow soldering.
• NFp21 is specially adapted for reflow soldering.
Part Number
Size (mm)
o Flow Soldering
NFM3DC
NFM3DP
NFM31P
NFM41C
NFM41P
4.4
4.4
6.0
1.4
1.4
2.0
Part Number
Size (mm)
d
1.0
1.2
1.2
e
2.0
2.6
2.6
f
2.4
3.0
3.0
g
1.0
1.0
1.5
ab
2.5
2.5
3.5
c
Small diameter
thru hole ø0.4
a
e
0.6
f
g
b
c
d
Land Pattern
Land Pattern
+ Solder Resist
Solder Resist
(in mm)
2.6
4.4
4.4
6.0
-
1.4
1.4
2.0
d
0.8
1.0
1.2
1.2
e
1.9
2.0
2.6
2.6
f
2.3
2.4
3.0
3.0
g
0.6
1.0
1.0
1.5
ab
1.4
2.5
2.5
3.5
c
Small diameter thru hole ø0.4Small diameter thru hole ø0.4
NFM3DC/NFM3DP/
NFM31P
NFM41C/NFM41P
NFM21C/NFR21G
NFM21P/NFL21S
Chip mounting side
b
a
e
0.6
f
g
c
d
a
e
0.6
f
g
c
d
Chip mounting side
0.4
1.0
1.2
Small diameter thru hole
ø1.0-ø2.0
Chip
2.0
0.8
0.8
0.4
0.4
0.6
1.0
1.5
2.2
0.4
0.6 1.2
Please contact us if using
thinner land pad than 18µm.
Small diameter thru hole
ø0.2-ø0.3
Small diameter thru hole
ø0.2-ø0.3
NFL18SPNFM18PS NFM55P
Reflow Soldering
NFM18C/NFM18PC/
NFL18ST
Small diameter thru hole
ø0.2
1.2
1.5
0.4
0.1
1.2
0.8
2.0
0.05
6.4 6.5
2.0
1.5
4.7
6.7
5.0 3.5