Datasheet

Chip Ferrite BeadChip EMIFILr
Chip Common Mode Choke Coil
Block Type EMIFILrMicrowave Absorber
!Note
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C31E.pdf
09.4.20
128
2. Solder Paste Printing and Adhesive Application
NFp Chip EMIFILr Soldering and Mounting
When reflow soldering the chip EMI suppression filter, the
printing must be conducted in accordance with the
following cream solder printing conditions.
If too much solder is applied, the chip will be prone to
damage by mechanical and thermal stress from the PCB
and may crack.
Standard land dimensions should be used for resist and
copper foil patterns.
When flow soldering the EMI suppression filter, apply the
adhesive in accordance with the following conditions.
If too much adhesive is applied, then it may overflow into
the land or termination areas and yield poor solderability.
In contrast, if insufficient adhesive is applied, or if the
adhesive is not sufficiently hardened, then the chip may
become detached during flow soldering process.
(in mm)
Series Solder Paste Printing Adhesive Application
Continued on the following page.
NFM
NFR
NFL
oGuideline of solder paste thickness:
100-150µm: NFM18/21/3D/31P, NFR, NFL
150-200µm: NFM55P
100-200µm: NFM41
NFM3D/31P/41 Series
Apply 0.1mg for NFM41C/41 and 0.06mg for
NFM3D/NFM31P of bonding agent at each chip.
Do not cover electrodes.
Bonding agent
Coating position of
bonding agent
NFM3DC/3DP NFM31P
NFM18C/18PC
NFL18ST
NFM41C/41P NFM55P
2.2
1.0
0.4
0.6
1.2
0.4
NFL18SP
0.4
1.0
2.0
0.4
1.2
NFM21C/21P
NFR21G/NFL21S
1.4
0.6
0.8
0.6
1.9
2.6
2.0
2.5
3.9
1.0
0.6
0.8
2.6
3.5
5.5
1.5
0.6
1.0
3.5
4.7
6.7
1.5
5.0
6.5
NFM18PS
0.8
0.4
0.1
1.2
1.20.05
2.0
2.6
2.5
4.4
1.0
0.6
1.2