Datasheet

Chip Ferrite BeadChip EMIFILr
Chip Common Mode Choke Coil
Block Type EMIFILrMicrowave Absorber
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
C31E.pdf
09.4.20
129
(in mm)
Series Solder Paste Printing Adhesive Application
NFE61P
oGuideline of solder paste thickness:
150-200µm
Apply 1.0mg of bonding agent at each chip.
2.6
4.8
8.8
1.5
1.6
Bonding agent
3.2
1.5
0.6
4.8
9.0
1.2
Bonding agent
NFA
oGuideline of solder paste thickness:
100-200µm: NFA31G/31C
100-150µm: NFA18S/21S
NFA31G/31C
NFA21S
NFA18S
0.3
0.8 Pitch
2.2
0.4
1.0
2.6
0.6
0.5 1.5
0.25 0.25
0.5
1.75
0.25
0.75
1.375
0.4
0.175
0.225
1.3
0.05
2.0
0.175
NFW31S
NFE31P
NFW31S Series
Apply 0.2mg of bonding agent at each chip.
oGuideline of solder paste thickness:
150-200µm
2.6
2.2
4.2
0.6
0.6 1.0
Coating positon of
bonding agent
Bonding agent
NFp Chip EMIFILr Soldering and Mounting