Datasheet

Chip Ferrite BeadChip EMIFILr
Chip Common Mode Choke Coil
Block Type EMIFILrMicrowave Absorber
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
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C31E.pdf
09.4.20
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3. Standard Soldering Conditions
NFp Chip EMIFILr Soldering and Mounting
(1) Soldering Methods
Use flow and reflow soldering methods only.
Use standard soldering conditions when soldering chip
EMI suppression filters.
In cases where several different parts are soldered, each
having different soldering conditions, use those
conditions requiring the least heat and minimum time.
Solder: Use Sn-3.0Ag-0.5Cu solder. Use of Sn-Zn based
solder will deteriorate performance of products.
If using NFM series with Sn-Zn based solder, please
contact Murata in advance.
Flux:
o Use Rosin-based flux.
In case of using RA type solder, products should be
cleaned completely with no residual flux.
o Do not use strong acidic flux (with chlorine content
exceeding 0.20wt%)
o Do not use water-soluble flux.
For additional mounting methods, please contact Murata.
oFlow Soldering Profile
(Sn-3.0Ag-0.5Cu Solder)
NFM3DC/3DP/31PC
NFM41C/41P
NFE61P
Series
Pre-heating
Standard Profile Limit Profile
Heating
Temp. (T1) Temp. (T2)Time. (t1)
150°C 60s min. 250°C 4 to 6s
2 times
max.
5s max.
2 times
max.
265±3°C
150°C 60s min. 250°C 4 to 6s
2 times
max.
5s max.
1 time
265±3°C
Time. (t2)
Heating
Cycle
of Flow
Temp. (T3) Time. (t2)
Cycle
of Flow
T1
T3
T2
Temperature (°C)
Pre-heating Time (s)
t2
Heating
Limit Profile
Standard Profile
t1
(2) Soldering Profile
oReflow Soldering Profile
(Sn-3.0Ag-0.5Cu Solder)
NFA, NFE
NFL, NFM (Except NFM55P)
NFR
NFW31S, NFM55P
Series
Standard Profile Limit Profile
Temp. (T1) Time. (t1)
Heating
220°C min. 30 to 60s 245±3°C
2 times
max.
230°C min. 260°C/10s
2 times
max.
60s max.
220°C min. 30 to 60s 245±3°C
2 times
max.
230°C min. 260°C/10s 1 time60s max.
Cycle
of Reflow
Peak
Temperature
(T2)
Temp. (T3) Time. (t2)
Heating
Cycle
of Reflow
Peak
Temperature
(T4)
NFW31S
150
180
T2
T4
T3
T1
Temperature (°C)
90s±30s Time (s)
t2
t1
Limit Profile
Standard Profile
Pre-heating