Datasheet

Chip Ferrite BeadChip EMIFILr
Chip Common Mode Choke Coil
Block Type EMIFILrMicrowave Absorber
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
C31E.pdf
09.4.20
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4. Cleaning
(3) Reworking with Solder Iron
The following conditions must be strictly followed when
using a soldering iron.
Pre-heating: 150°C 60s min.*
1
*
1
NFM55P: 100°C/60s+200°C/60s
Soldering iron power output / Tip diameter:
30W max. / ø3mm max.
Temperature of soldering iron tip / Soldering time / Times:
350°C max. / 3-4s / 2 times*
2
*
2
NFE31PT152Z1E9: 280°C max. / 10s max. / 2 times
Do not allow the tip of the soldering iron to directly
contact the chip.
For additional methods of reworking with a soldering iron,
please contact Murata engineering.
Following conditions should be observed when cleaning
chip EMI filter.
(1) Cleaning Temperature: 60°C max. (40°C max. for
alcohol type cleaner)
(2) Ultrasonic
Output: 20W/liter max.
Duration: 5 minutes max.
Frequency: 28 to 40kHz
(3) Cleaning Agent
The following list of cleaning agents have been tested on
the individual components. Evaluation of final assembly
should be completed prior to production.
(a) Alcohol cleaning agent
Isopropyl alcohol (IPA)
(b) Aqueous cleaning agent
Pine Alpha ST-100S
(4) Ensure that flux residue is completely removed.
Component should be thoroughly dried after aqueous
agent has been removed with deionized water.
NFp Chip EMIFILr Soldering and Mounting