Datasheet

Chip Ferrite BeadChip EMIFILr
Chip Common Mode Choke Coil
Block Type EMIFILrMicrowave Absorber
!Note
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C31E.pdf
09.4.20
156
2. Solder Paste Printing and Adhesive Application
(in mm)
When reflow soldering the chip common mode choke
coils, the printing must be conducted in accordance with
the following cream solder printing conditions.
If too much solder is applied, the chip will be prone to
damage by mechanical and thermal stress from the PCB
and may crack.
Standard land dimensions should be used for resist and
copper foil patterns.
When flow soldering the chip common mode choke coils,
apply the adhesive in accordance with the following
conditions.
If too much adhesive is applied, then it may overflow into
the land or termination areas and yield poor solderability.
In contrast, if insufficient adhesive is applied, or if the
adhesive is not sufficiently hardened, then the chip may
become detached during flow soldering process.
DLP
DLW
DLM
oGuideline of solder paste thickness:
100-150µm: DLW21S/21H/31S,
DLP0NS/11S/2AD/DLM11G
150-200µm: DLP31D/31S, DLM2HG,
DLW5AH/5BS/5BT
*Solderability is subject to reflow conditions and
thermal conductivity. Please make sure that your
product has been evaluated in view of your
specifications with our product being mounted to your
product.
DLP31S/DLM2HG/DLP31D
Apply 0.3mg of bonding agent at each chip.
Series Solder Paste Printing Adhesive Application
DLP31SDLP31D
Coating Position of
Bonding Agent
Coating Position of
Bonding Agent
DLM2HG
Coating Position of
Bonding Agent
aba
cc
d
DLW21S/21H/31SDLP0NS/11S/31S/DLM11G
a
b
c
d
DLW5AH/5BS/5BT
5.5
2.9
0.9
1.3
3.3
4.7
DLP2AD/31D
d
c
a ab
DLM2HG
0.4
1.0
4.0
1.2 2.0
DLP0NS
DLP11S
DLP31S
DLM11G
0.3
0.7
1.0
0.5
0.3
0.3
0.7
0.4
Series a
0.5
0.55
2.1
0.7
d
0.3
0.55
0.6
0.5
bc
DLW21S/H
DLW31S
0.8
1.6
0.5
0.4
Series a
1.2
1.6
d
2.6
3.7
bc
DLP2AD
DLP31D
0.55
1.0
0.25
0.4
Series a
0.5
0.8
d
0.4
0.8
bc
DLp Chip Common Mode Choke Coil Soldering and Mounting