Datasheet

Chip Ferrite BeadChip EMIFILr
Chip Common Mode Choke Coil
Block Type EMIFILrMicrowave Absorber
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
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C31E.pdf
09.4.20
157
3. Standard Soldering Conditions
DLp Chip Common Mode Choke Coil Soldering and Mounting
(1) Soldering Methods
Use flow and reflow soldering methods only.
Use standard soldering conditions when soldering chip
common mode choke coils.
In cases where several different parts are soldered, each
having different soldering conditions, use those
conditions requiring the least heat and minimum time.
Solder: Use Sn-3.0Ag-0.5Cu solder. Use of Sn-Zn based
solder will deteriorate performance of products.
If using DLP/DLM series with Sn-Zn based solder,
please contact Murata in advance.
Flux:
o Use Rosin-based flux.
In case of DLW21/31 series, use Rosin-based flux with
converting chlorine content of 0.06 to 0.1wt%.
In case of using RA type solder, products should be
cleaned completely with no residual flux.
o Do not use strong acidic flux (with chlorine content
exceeding 0.20wt%)
o Do not use water-soluble flux.
For additional mounting methods, please contact Murata.
oFlow Soldering Profile
(Sn-3.0Ag-0.5Cu Solder)
DLM2HG
DLP31D/31S
Series
Pre-heating
Standard Profile Limit Profile
Heating
Temp. (T1) Temp. (T2)Time. (t1)
150°C 60s min. 250°C 4 to 6s
2 times
max.
5s max.
2 times
max.
265±3°C
Time. (t2)
Heating
Cycle
of Flow
Temp. (T3) Time. (t2)
Cycle
of Flow
T1
T3
T2
Temperature (°C)
Pre-heating Time (s)
t2
Heating
Limit Profile
Standard Profile
t1
(2) Soldering Profile
oReflow Soldering Profile
(Sn-3.0Ag-0.5Cu Solder)
DLM/DLP
DLW21/31
DLW5A/5B
Series
Standard Profile Limit Profile
Temp. (T1)
Time. (t1)
Heating
220°C min. 30 to 60s 245±3°C
2 times
max.
230°C min. 260°C/10s
2 times
max.
60s max.
220°C min. 30 to 60s 250±3°C
2 times
max.
230°C min. 260°C/10s
2 times
max.
60s max.
Cycle
of Reflow
Peak
Temperature
(T2)
Temp. (T3) Time. (t2)
Heating
Cycle
of Reflow
Peak
Temperature
(T4)
150
180
T2
T4
T3
T1
Temperature (°C)
90s±30s time (s)
t2
t1
Limit Profile
Standard Profile
Pre-heating