Datasheet

Chip Ferrite BeadChip EMIFILr
Chip Common Mode Choke Coil
Block Type EMIFILr
Microwave Absorber
!Note
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C31E.pdf
09.4.20
170
BNX
1. Standard Land Pattern Dimensions
3. Standard Soldering Conditions
Soldering and MountingBlock Type EMIFILr
SMD Type
When reflow soldering the block type EMIFILr, the
printing must be conducted in accordance with the
following cream solder printing conditions.
If too much solder is applied, the chip will be prone to
damage by mechanical and thermal stress from the PCB
and may crack.
Standard land dimensions should be used for resist and
copper foil patterns.
BNX022
BNX023
(1) A double-sided print board (or multilayer board) as shown in
the left figure is designed, and please apply a soldering Cu
electrode with a product electrode to a "Land Pattern", apply
resist to a "Land Pattern + Solder Resist" at Cu electrode.
(2) Please drop CG on a ground electrode on the back layer
(the same also in a multilayer case) by the through hole. And
a surface grand electrode layer may also take a large area
as much as possible.
(3) It is recommended to use a double-sided printed circuit
board with BNX mounting on one side and the ground
pattern on the other in order to maximize filtering
performance, multiple feed through holes are required to
maximize the BNX's connection to ground.
(4) The ground pattern should be designed to be as large as
possible to achieve maximum filtering performance.
B
PSG
CG
CG
CB
CG
12.5
10.2
9.9
9.6
7.1
6.2
5.3
2.8
2.3
0
0
3.8 5.8
10.3 13.7 17.5 13.2
2. Solder Paste Printing and Adhesive Application
(1) Soldering Methods
Use reflow soldering methods only.
Use standard soldering conditions when soldering block
type EMIFILr SMD type.
In cases where several different parts are soldered, each
having different soldering conditions, use those
conditions requiring the least heat and minimum time.
Solder: Use Sn-3.0Ag-0.5Cu solder. Use of Sn-Zn based
solder will deteriorate performance of products.
Flux:
o Use Rosin-based flux.
In case of using RA type solder, products should be
cleaned completely with no residual flux.
o Do not use strong acidic flux (with chlorine content
exceeding 0.20wt%)
o Do not use water-soluble flux.
For additional mounting methods, please contact Murata.
BNX022
BNX023
oGuideline of solder paste thickness:
150-200µm
Series Solder Paste Printing Adhesive Application
B
PSG
CG
CG
CG
12.5
10.2
9.6
7.1
5.3
2.8
2.3
0
0
3.8 5.8
10.3 13.7 17.5
CB
Land Pattern
Land Pattern
+ Solder Resist
Solder Resist
(in mm)