Datasheet

Chip Ferrite BeadChip EMIFILr
Chip Common Mode Choke Coil
Block Type EMIFILr
Microwave Absorber
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
C31E.pdf
09.4.20
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4. Cleaning
Soldering and MountingBNX Block Type EMIFILr SMD Type
oReflow Soldering Profile
(Sn-3.0Ag-0.5Cu solder)
Series
Standard Profile Limit Profile
Temp. (T1) Time. (t1)
Heating
Cycle
of Reflow
Peak
Temperature
(T2)
Temp. (T3) Time. (t2)
Heating
Cycle
of Reflow
Peak
Temperature
(T4)
BNX022/023
220°C min. 30 to 60s 250±3°C
2 times
max.
230°C min. 260°C/10s
2 times
max.
60s max.
150
180
T2
T4
T3
T1
Temperature (°C)
90s±30s Time (s)
t2
t1
Limit Profile
Standard Profile
Pre-heating
(2) Soldering Profile
Do not clean BNX022/023 series. In case of cleaning, please contact Murata engineering.
(3) Reworking with Solder Iron
The following conditions must be strictly followed when
using a soldering iron.
Pre-heating: 150°C 60s min.
Soldering iron power output: 100W max.
Temperature of soldering iron tip / Soldering time / Times:
450°C max. / 5s max. / 1 time
Do not allow the tip of the soldering iron to directly
contact the chip.
For additional methods of reworking with a soldering iron,
please contact Murata engineering.