Datasheet

Chip Ferrite BeadChip EMIFILr
Chip Common Mode Choke Coil
Block Type EMIFILrMicrowave Absorber
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
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C31E.pdf
09.4.20
83
2. Solder Paste Printing and Adhesive Application
When reflow soldering the chip ferrite beads, the printing
must be conducted in accordance with the following
cream solder printing conditions.
If too much solder is applied, the chip will be prone to
damage by mechanical and thermal stress from the PCB
and may crack.
Standard land dimensions should be used for resist and
copper foil patterns.
When flow soldering the chip ferrite beads, apply the
adhesive in accordance with the following conditions.
If too much adhesive is applied, then it may overflow into
the land or termination areas and yield poor solderability.
In contrast, if insufficient adhesive is applied, or if the
adhesive is not sufficiently hardened, then the chip may
become detached during flow soldering process.
BLM
BLM18/21/31/41 Series
(Except BLM18G Series)
Coating amount is illustrated in the
following diagram.
(in mm)
oEnsure that solder is applied smoothly to a
minimum height of 0.2mm to 0.3mm at the end
surface of the part.
oGuideline of solder paste thickness:
50-80µm: BLM02
100-150µm: BLM03
100-200µm: BLM15/18/21/31/41
0.2−0.3mm min.
a: 20−70µm
b: 30−35µm
c: 50−105µm
c
a
b
Chip Solid Inductor
Bonding agent
Land
PCB
BLA
BLA31 Series
Coating amount is illustrated in the
following diagram.
oGuideline of solder paste thickness:
100-150µm: BLA2A
150-200µm: BLA31
a: 20−70µm
b: 30−35µm
c: 50−105µm
c
a
b
Chip Solid Inductor
Bonding Agent
Land
PCB
Series Solder Paste Printing Adhesive Application
(Except BLM
15_AN1 series)
0.4
1.75
0.5 0.5 0.5
1.5
0.8
0.25 0.25
0.80.7 0.7
BLA31 BLA2A
3. Standard Soldering Conditions
(1) Soldering Methods
Use flow and reflow soldering methods only.
Use standard soldering conditions when soldering chip
ferrite beads.
In cases where several different parts are soldered, each
having different soldering conditions, use those
conditions requiring the least heat and minimum time.
Solder: Use Sn-3.0Ag-0.5Cu solder. Use of Sn-Zn based
solder will deteriorate performance of products.
If using BLA series with Sn-Zn based solder,
please contact Murata in advance.
Flux:
o Use Rosin-based flux.
In case of using RA type solder, products should be
cleaned completely with no residual flux.
o Do not use strong acidic flux (with chlorine content
exceeding 0.20wt%)
o Do not use water-soluble flux.
For additional mounting methods, please contact Murata.
BLp Chip Ferrite Bead Soldering and Mounting