Datasheet

!
Note
• Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.
141
GRM SeriesGJM SeriesGMA SeriesGMD SeriesGQM SeriesGRJ SeriesGR3 SeriesKRM SeriesKR3 SeriesLLA SeriesLLL SeriesLLM SeriesLLR Series
!
Caution/
Notice
!Caution/Notice
!Caution
Notice
c Storage and Operation Conditions
........................
142
c Rating
....................................................................
142
1. Temperature Dependent Characteristics
...........
142
2. Measurement of Capacitance
............................
142
3. Applied Voltage
.................................................
143
4. Type of Applied Voltage and
Self-heating Temperature
..................................
143
5. DC Voltage and AC Voltage Characteristics
.....
146
6. Capacitance Aging
............................................
146
7. Vibration and Shock
..........................................
147
c Soldering and Mounting
........................................
147
1. Mounting Position
..............................................
147
2. Information before Mounting
..............................
148
3. Maintenance of the Mounting
(pick and place) Machine
...................................
148
4-1. Reflow Soldering
............................................
149
4-2. Flow Soldering
................................................
150
4-3. Correction of Soldered Portion
.......................
151
5. Washing
.............................................................
152
6. Electrical Test on Printed Circuit Board
.............
152
7. Printed Circuit Board Cropping
..........................
152
8. Assembly
...........................................................
155
9. Die Bonding/Wire Bonding
................................
156
c Other
.....................................................................
156
1. Under Operation of Equipment
..........................
156
2. Other
..................................................................
156
c Rating
....................................................................
157
1. Operating Temperature
.....................................
157
2. Atmosphere Surroundings
(gaseous and liquid)
..........................................
157
3. Piezo-electric Phenomenon
...............................
157
c Soldering and Mounting
........................................
157
1. PCB Design
.......................................................
157
1. Notice for Pattern Forms
...............................
157
2. Land Dimensions
...........................................
158
3. Board Design
.................................................
160
2. Adhesive Application
.........................................
160
3. Adhesive Curing
................................................
160
4. Flux for Reflow and Flow Soldering
...................
161
5. Flow Soldering
...................................................
161
6. Washing
.............................................................
161
7. Coating
..............................................................
161
c Other
.....................................................................
162
1. Transportation
...................................................
162
2. Characteristics Evaluation
in the Actual System
..........................................
162