Datasheet

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Note
• Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.
149
GRM SeriesGJM SeriesGMA SeriesGMD SeriesGQM SeriesGRJ SeriesGR3 SeriesKRM SeriesKR3 SeriesLLA SeriesLLL SeriesLLM SeriesLLR Series
!
Caution
4-1. Reflow Soldering
1. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both the components and the PCB.
Preheating conditions are shown in table 1. It is required to
keep the temperature differential between the solder and
the components surface (ΔT) as small as possible.
2. Solderability of tin plating termination chips might be
deteriorated when a low temperature soldering profile
where the peak solder temperature is below the melting
point of tin is used. Please confirm the solderability of tin
plated termination chips before use.
3. When components are immersed in solvent after mounting,
be sure to maintain the temperature difference (ΔT)
between the component and the solvent within the range
shown in table 1.
Recommended Conditions
[Standard Conditions for Reflow Soldering]
[Allowable Reflow Soldering Temperature and Time]
In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.
Temperature
Incase of Lead Free Solder
( ): In case of Pb-Sn Solder
Soldering Time (s)
260
270
280
250
240
230
220
0 30 60 90 120
Soldering Temperature (°C)
Inverting the PCB
Make sure not to impose any abnormal mechanical shocks
to the PCB.
Continued from the preceding page.
Continued on the following page.
Peak Temperature
Atmosphere
Pb-Sn Solder
Reflow
230 to 250°C
Air
Vapor Reflow
230 to 240°C
Saturated vapor
of inactive solvent
Lead Free
Solder
240 to 260°C
Air or N2
Reflow
Vapor Reflow
60-120 seconds 30-60 seconds
ΔT
Gradual
Cooling
Soldering
Preheating
220°C (200°C)
190°C (170°C)
170°C (150°C)
150°C (130°C)
Time
Temperature (°C)
Peak Temperature
60-120 seconds 20 seconds max.
ΔT
Gradual
Cooling
Soldering
Preheating
190°C (170°C)
170°C (150°C)
150°C (130°C)
Time
Temperature (°C)
Peak Temperature
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
4. Optimum Solder Amount for Reflow Soldering
4-1. Overly thick application of solder paste results in a
excessive solder fillet height.
This makes the chip more susceptible to mechanical
and thermal stress on the board and may cause the
chips to crack.
4-2. Too little solder paste results in a lack of adhesive
strength on the outer electrode, which may result in
chips breaking loose from the PCB.
4-3. Make sure the solder has been applied smoothly to
the end surface to a height of 0.2mm
∗
min.
0.2mm
∗
min.
∗
02/03 sizes: 1/3 of Chip Thickness min.
in section
GJM/GQM/GR3/GRJ/GRM/KRM/LLL/
LLR Series02/03/15/18/21/31 sizes
LLL Series 1U size
ΔTV190°C
ΔTV130°C
Part Number
Temperature Differential
Table 1
GR3/GRJ/GRM/KR3/KRM Series
32/43/55 sizes
LLA/LLM Series 18/21/31 sizes
GQM Series 22 size
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Caution