Information

GRM SeriesGJM SeriesGMA SeriesGMD SeriesGQM SeriesGRJ SeriesGR3 SeriesKRM SeriesKR3 SeriesLLA SeriesLLL SeriesLLM SeriesLLR Series
!
Caution/
Notice
111
!
Note
• Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.
Features
Product for Bonding/AuSn Soldering
GMD Series
This capacitor is compatible to wire bonding mounting by the external electrodes
of Au plating.
Can be mounted by wire bonding and AuSn soldering.
1
Ideal for mounting in packages, such as optical communication related devices , IC and etc.
2
Since the external electrodes are based on the Au plating specification, mounting by wire/die bonding is possible.
Noise can be reduced by eliminating the routing of the wire, and high efficiency can be achieved
with a built-in capacitor in the package, such as TO-CAN, IC and etc. by wire bonding mounting.
Specifications
Contributes to the miniaturization of the set.
3
Murata offers a lineup of small size products, such as the 0603 (0201) and 1005 (0402) in mm (inch).
Au/Sn solder
Au pad
Epoxy
Au wire
<Mounting Example>
Au plated layer
Foundation Electrode Layer
Ni plated layer
<Example of Structure>
Internal Electrodes
Ceramic
Size
Rated Voltage DC6.3V to 50V
Capacitance 100pF to 1.0μF
Main Applications
1. Optical communication related equipment
2. Mounting in IC packages
0.6×0.3mm to 1.0×0.5mm
<Dimensions>
ege
L
W
T
This catalog contains only a portion of the product lineup.
Please refer to the capacitor search tool on the Murata Web site for details.