Information

!
Note
• Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.
160
GRM Series GJM Series GMA Series GMD Series GQM Series GRJ Series GR3 Series KRM Series KR3 Series LLA Series LLL Series LLM Series LLR Series Notice
Continued from the preceding page.
3. Adhesive Curing
1. Insufficient curing of the adhesive can cause chips to
disconnect during flow soldering and causes deterioration
in the insulation resistance between the outer electrodes
due to moisture absorption.
Control curing temperature and time in order to prevent
insufficient hardening.
2. Adhesive Application
1. Thin or insufficient adhesive can cause the chips to
loosen or become disconnected during flow soldering.
The amount of adhesive must be more than dimension c,
shown in the drawing at right, to obtain the correct
bonding strength.
The chip's electrode thickness and land thickness must
also be taken into consideration.
2. Low viscosity adhesive can cause chips to slip after
mounting. The adhesive must have a viscosity of
5000Pa
s s (500ps) min. (at 25°C).
3. Adhesive Coverage
Land
Adhesive
Board
Chip Capacitor
a
b
c
c=50 to 105μm
b=30 to 35μm
a=20 to 70μm
*Nominal Value
1.6g0.8
2.0g1.25
3.2g1.6
0.05mg min.
0.1mg min.
0.15mg min.
Size (LgW) (in mm)
Adhesive Coverage*
Continued on the following page.
3. Board Design
When designing the board, keep in mind that the amount
of strain which occurs will increase depending on the size
and material of the board.
[Relationship with amount of strain to the board thickness,
length, width, etc.]
ε=
ȇ/
2Ewh
2
Relationship between load and strain
When the load is constant, the following relationship can be established.
· As the distance between the supporting points (/) increases, the amount of
strain also increases.
→Reduce the distance between the supporting points.
· As the elastic modulus (E) decreases, the amount of strain increases.
→Increase the elastic modulus.
· As the board width (w) decreases, the amount of strain increases.
→Increase the width of the board.
· As the board thickness (h) decreases, the amount of strain increases.
→Increase the thickness of the board.
Since the board thickness is squared, the effect on the amount of strain
becomes even greater.
ε: Strain on center of board (μst)
/: Distance between supporting points (mm)
w: Board width (mm)
h: Board thickness (mm)
E: Elastic modulus of board (N/m
2
=Pa)
Y: Deflection (mm)
P: Load (N)
/
w
Y
h
ȇ
Notice