Data Sheet

Preliminary Specification Number : SP-ZZ1PJ-331-K
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Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata(China) Investment Co., Ltd.
19. NOTICE
19.1. Storage Conditions:
Please use this product within 6month after receipt.
- The product shall be stored without opening the packing under the ambient temperature from 5 to
35deg.C and humidity from 20 to 70%RH.
(Packing materials, in particular, may be deformed at the temperature over 40deg.C.)
- The product left more than 6months after reception, it needs to be confirmed the solderbility before
used.
- The product shall be stored in non corrosive gas (Cl
2
, NH
3
, SO
2
, No
x
, etc.).
- Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp
object and dropping the product, shall not be applied in order not to damage the packing materials.
This product is applicable to MSL3 (Based on JEDEC Standard J-STD-020)
- After the packing opened, the product shall be stored at <30deg.C / <60%RH and the product shall be
used within 168hours.
- When the color of the indicator in the packing changed, the product shall be baked before soldering.
Baking condition: 125+5/-0deg.C, 24hours, 1time
The products shall be baked on the heat-resistant tray because the material (Base Tape, Reel Tape and
Cover Tape) are not heat-resistant.
19.2. Handling Conditions:
Be careful in handling or transporting products because excessive stress or mechanical shock may
break products.
Handle with care if products may have cracks or damages on their terminals, the characteristics of
products may change. Do not touch products with bear hands that may result in poor solder ability and
destroy by static electrical charge.
19.3. Standard PCB Design (Land Pattern and Dimensions):
All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern
should be provided between IN and OUT terminals. Please refer to the specifications for the standard
land dimensions.
The recommended land pattern and dimensions is as Murata's standard. The characteristics of
products may vary depending on the pattern drawing method, grounding method, land dimensions,
land forming method of the NC terminals and the PCB material and thickness. Therefore, be sure to
verify the characteristics in the actual set. When using non-standard lands, contact Murata beforehand.
19.4. Notice for Chip Placer:
When placing products on the PCB, products may be stressed and broken by uneven forces from a
worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to
follow the specifications for the maintenance of the chip placer being used. For the positioning of
products on the PCB, be aware that mechanical chucking may damage products.