Data Sheet

Preliminary Specification Number : SP-ZZ1PJ-331-K
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Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata(China) Investment Co., Ltd.
1. SCOPE
This specification is applied to the IEEE802.11a/b/g/n/ac W-LAN + Bluetooth 5.0 combo module.
2. KEY FEATURE
- Chipset: QCA9377-3
- Size: 7.2 x 7.4 x 1.25 (max) mm
- Weight: 0.15g/pc
- PCB w/ shielded resin mold module
- IEEE802.11a/b/g/n/ac dual band 2.4G/5G
- Supports BT5.0 (Except Options)
- SDIO 3.0 supporting SDR104 (WLAN), UART/PCM (Bluetooth)
- Lead Free Module
3. Manufacturing site
Company name:
Shenzhen Murata Technology Co., Ltd.
Address:
15 Cuijing Road, Longtian Street, Shenzhen Grand Industrial Zone, PingShan District, Shenzhen,
Guangdong, 518118 China
4. Part Number
Ordering Part Number
Description
LBEE5ZZ1PJ-331TEMP
In case of sample order
5. RoHS Compliance
This module is compliant with the RoHS directive.
6. Block Diagram