Datasheet

"Reflow Soldering profile
(Sn-3.0Ag-0.5Cu solder)
Series
Standard Profile Limit Profile
Temp. (T1)
Time. (t1)
Heating
220°C 30 to 60s 245±3°C
2 times
max.
230°C 260°C/10s
2 times
max.
60s max.
Cycle
of reflow
Peak
temperature
(T2)
Temp. (T3) Time. (t2)
Heating
Cycle
of reflow
Peak
temperature
(T4)
150
180
T2
T4
T3
T1
Temperature (°C)
90±30s time (s)
t2
t1
Limit Profile
Standard Profile
Pre-heating
LQG15H/18H
LQW04A/15A/18A/21H
LQW2BA/2UA
LQP02T/03T/15M/15T/18M
LQW2BH/31H
LQH31H
(2) Soldering profile
"Flow Soldering profile
(Sn-3.0Ag-0.5Cu solder)
Series
Pre-heating
Standard Profile Limit Profile
Heating
Temp. (T1) Temp. (T2)
Time. (t1)
150°C 60s min. 250°C 4 to 6s
2 times
max.
5s max.
2 times
max.
265±3°C
Time. (t2)
Heating
Cycle
of flow
Temp. (T3) Time. (t2)
Cycle
of flow
T1
T3
T2
Temperature (°C)
Pre-heating time (s)
t2
Heating
Limit Profile
Standard Profile
t1
LQW2BH/31H
LQH31H
(3) Reworking with Soldering Iron *Except LQP02T Series
Preheating at 150°C for 1 minute is required. Do not
directly touch the ceramic element with the tip of the
soldering iron. The reworking soldering conditions are as
follows:
Soldering iron power output: 80W max.
Temperature of soldering iron tip: 350°C
Diameter of soldering iron end: 3.0mm max.
Soldering time: within 3 s
Continued on the following page.
RF Inductor Soldering and Mounting
168
Inductor for Low Frequency CircuitsRF Inductor
Soldering and Mounting
Inductor for Power Lines (Power Inductor)
!Note
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
O05E.pdf
Oct.13,2011