Datasheet

3. Mounting Instructions
(3) PCB Warping
PCB should be designed so that products are not
subjected to the mechanical stress caused by warping
the board.
Poor example
Products should be located in the sideways direction
(Length: a<b) to the mechanical stress.
Good example
a
b
Poor example
The electrode part of the product should be located
like the picture to the mechanical stress.
Good example
(1) Land Pattern Dimensions
Large lands reduce Q of the mounted chip. Also, large
protruding land areas (bordered by lines having
dimensions 'c' and 'd' shown) cause floating and
electrode leaching.
(2) Magnetic Coupling
Since some chip inductors (chip coils) are constructed
like an open magnetic circuit, narrow spacing between
inductors (coils) may cause magnetic coupling.
LQM series have a magnetically shielded structure. The
structure makes their coupling coefficient smaller than
that of conventional chip inductors (chip coils).
d
c
Magnetic Coupling
Land
Solder Resist
electrode
electrode
LQMLQH_M
(4) Amount of Solder Paste
Excessive solder causes electrode corrosion, while
insufficient solder causes low electrode bonding strength.
Adjust the amount of solder paste as shown on the right
so that solder is applied.
" Guideline of solder paste thickness
· LQM: 100 to 150µm
· LQHs except for ones written above: 200 to 300µm
Continued on the following page.
Inductor for Low Frequency Circuits Soldering and Mounting
109
Inductor for Low Frequency CircuitsRF Inductor
Soldering and Mounting
Inductor for Power Lines (Power Inductor)
!Note
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
O05E.pdf
Oct.13,2011