Datasheet

3
100
80
60
40
20
0
50k10k 100k 500k 1M 5M 10M
A
B
C
14
10
12
8
6
4
0
2
1023456
2.5 2.5
2.5
1
2
1
11
5.5
1.3
High Q at intermeditate
frequency
Industrial standard design
Small size, but high Q
oTechnical Data
High Q
Large inductance
Construction Features
RF Inductor
Wire Wound Type
For Radio Frequency
Wire Wound Type
For Intermediate
Frequency
Multilayer Type
Film Type
Wire
Wire
Electrode
Outer electrode
Outer electrode
Coil pattern
Non-magnetic
ceramic
Electrode
Resin coating
on the top
Resin coating
on the top
Ferrite core for
high frequency
Non-magnetic
ceramic core
Inner electrode
which is produced
using
photolithography
process
1. Land Area and Q-F Characteristics 2. Coupling Coefficient Versus Distance between Parts
LQH32MN680K23
LQH32M Series
PCB: Ag-Pb printed land formed on 0.6mm-thick
alumina plate
Soldering: Reflow soldering
Solder layer: Sections shown by oblique lines in figure
(in mm)
Characteristic of chip mounted on land
Characteristic of chip mounted on land
A : Net characteristics without land pattern
C :
B :
Distance between parts
Q
Frequency (Hz)
Distance between Parts (mm)
1µH
330µH
Coupling Coefficient (%)
!Note
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
O05E.pdf
Oct.13,2011