Datasheet

LQW_H
LQW2BH
LQH31H
LQW31H
0.15-0.20
0.20-0.25
(4) Amount of Adhesive
If too much adhesive is applied, then it may overflow into
the land or termination areas and yield poor solderability.
In contrast, if insufficient adhesive is applied, or if the
adhesive is not sufficiently hardened, then the chip may
become detached during flow soldering. Apply the
adhesive in accordance with the conditions shown in
chart.
Typical Application Amount (in:mg)
Part Number
IR-100
The following conditions should be observed when
cleaning chip inductors (chip coils):
(1) Cleaning Temperature: 60°C max. (40°C max. for
alcohol cleaning agents)
(2) Ultrasonic
Output: 20W/l max.
Duration: 5 minutes max.
Frequency: 28 to 40kHz
Care should be taken not to cause resonance of the
PCB and mounted products.
(3) Cleaning agent
The following cleaning agents have been tested on
individual components. Evaluation in complete assembly
should be done prior to production.
(a) Alcohol cleaning agents
Isopropyl alcohol (IPA)
(b) Aqueous cleaning agents
Pine Alpha ST-100S
(4) Ensure that flux residue is completely removed.
Component should be thoroughly dried after aqueous
agents have been removed with deionized water.
For additional cleaning methods, please contact Murata.
4. Cleaning
RF Inductor Soldering and Mounting
170
Inductor for Low Frequency CircuitsRF Inductor
Soldering and Mounting
Inductor for Power Lines (Power Inductor)
!Note
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
O05E.pdf
Oct.13,2011