Datasheet
The capacitor should be fully immersed, unagitated, in
reagent at 20 to 25 ˚C for 30T5 sec. and then remove
gently. Marking on the surface of the capacitor should
immediately be visually examined.
Reagent :
• Isopropyl alcohol
17
Solvent
Resistance
Appearance
No defects or abnormalities
Apply a DC voltage of 150% of the rated voltage for
1000
W
Y
48
0
hrs. at the maximum operating temperature.
Remove and set for 48T4 hrs. at room temperature,
then measure.
(Charge/Discharge current V 50mA)
• Pretreatment
Apply test voltage for 1 hr., at test temperature. Remove
and set for 48T4 hrs. at room temperature.
16
High
Temperature
Load
Appearance
No defects or abnormalities
Apply the rated voltage at 40T2˚C and relative humidity
of 90 to 95% for 500
W
Y
24
0
hrs. Remove and set for
48T4 hrs. at room temperature, then measure.
(Charge/Discharge current V 50mA)
15
Humidity
Load
Appearance
No defects or abnormalities
Set the capacitor at 40T2˚C and relative humidity of 90
to 95% for 500
W
Y
24
0
hrs. Remove and set for 48T4 hrs.
at room temperature, then measure.
14
Humidity
(Steady
State)
Appearance
No defects or abnormalities
The capacitor should be subjected to 200 temperature
cycles.
13
Temperature
Cycle
Appearance
No defects or abnormalities
The lead wire is immersed in the melted solder 1.5 to
2mm from the main body at 350T10˚C for 3.5T0.5 sec.
The specified items are measured after 48T4 hrs.
• Pretreatment
Perform a heat treatment at 150+0/-10˚C for 1 hr., and
then let sit at room temperature for 48T4 hrs.
12
Resistance
to
Soldering
Heat
Appearance
No defects or abnormalities
The terminal of a capacitor is dipped into a solution of
ethanol (JIS-K-8101) and rosin (JIS-K-5902) (25% rosin
in weight proportion) and then into molten solder (JIS-
Z-3282) for 2T0.5 sec. In both cases the depth of
dipping is up to about 1.5 to 2mm from the terminal
body.
Temp. of solder: 245T5˚C Lead Free Solder (Sn-3.0Ag-0.5Cu)
235T5˚C H60A or H63A Eutectic Solder
11 Solderability of Leads
Lead wire should be soldered with uniform coating on the axial
direction over 3/4 of the circumferential direction.
No. Test MethodSpecificationsItem
Continued from the preceding page.
Marking
Legible
Insulation
Resistance
50MΩ · µF min.
D.F.
0.04 max.
Capacitance
Change
Within T12.5%
Insulation
Resistance
50MΩ · µF min.
D.F.
0.05 max.
Capacitance
Change
Within T12.5%
Insulation
Resistance
50MΩ · µF min.
D.F.
0.05 max.
Capacitance
Change
Within T12.5%
Dielectric
Strength
(Between
Terminals)
No defects or abnormalities
Insulation
Resistance
50MΩ · µF min.
D.F.
0.05 max.
Capacitance
Change
Within T12.5%
Dielectric
Strength
(Between
Terminals)
No defects
Capacitance
Change
Within T7.5%
RPE Series Small Size, Large Capacitance Specifications and Test Methods
Temperature (˚C)Step
-55T3
Room Temp.
125T3
Room Temp.
Time (min)
30T3
3 max.
30T3
3 max.
1
2
3
4
Specifications and Test Methods
16
2
!Note
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note
C49E.pdf
10.3.8