Data Sheet

© 2007 Microchip Technology Inc. DS21919E-page 41
MCP23008/MCP23S08
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Device MCP23008: 8-Bit I/O Expander w/ I
2
C™ Interface
MCP23008T: 8-Bit I/O Expander w/ I
2
C Interface
(Tape and Reel)
MCP23S08: 8-Bit I/O Expander w/ SPI Interface
MCP23S08T: 8-Bit I/O Expander w/ SPI Interface
(Tape and Reel)
Temperature
Range
E= -40°C to +125°C (Extended) *
* While these devices are only offered in the “E”
temperature range, the device will operate at different
voltages and temperatures as identified in the
Section 2.0 “Electrical Characteristics”.
Package ML = Plastic Quad Flat, No Lead Package
4x4x0.9 mm Body (QFN), 20-Lead
P = Plastic DIP (300 mil Body), 18-Lead
SO = Plastic SOIC (300 mil Body), 18-Lead
SS = SSOP, (209 mil Body, 5.30 mm), 20-Lead
PART NO. X /XX
PackageTemperature
Range
Device
Examples:
a) MCP23008-E/P: Extended Temp.,
18LD PDIP package.
b) MCP23008-E/SO: Extended Temp.,
18LD SOIC package.
c) MCP23008T-E/SO: Tape and Reel,
Extended Temp.,
18LD SOIC package.
d) MCP23008-E/SS: Extended Temp.,
20LD SSOP package.
e) MCP23008T-E/SS: Tape and Reel,
Extended Temp.,
20LD SSOP package.
f) MCP23008-E/ML: Extended Temp.,
20LD QFN package.
a) MCP23S08-E/P: Extended Temp.,
18LD PDIP package.
b) MCP23S08-E/SO: Extended Temp.,
18LD SOIC package.
c) MCP23S08T-E/SO: Tape and Reel,
Extended Temp.,
18LD SOIC package.
d) MCP23S08-E/SS: Extended Temp.,
20LD SSOP package.
e) MCP23S08T-E/SS: Tape and Reel,
Extended Temp.,
20LD SSOP package.
f) MCP23S08T-E/MF: Tape and Reel,
Extended Temp.,
20LD QFN package.
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