Troubleshooting Manual
Table Of Contents
- Contact Information
- RELEASE CONTROL RECORD
- SECTION 3.1: Responding to alarms
- SECTION 3.2: Parts Information
- SECTION 3.3: Reading Electrical Schematics
- Figure SD-14: NAPF16 Low Pass Filter PWB
- Figure SD-15: NAPP15 Directional Coupler Bottom PWB
- Figure SD-1: VX150/VX300/VX600 and VX1 Transmitter - Control/Monitor Stage
- Figure SD-2: VX150/VX300/VX600 and VX1 Transmitter - Ac and RF Power Stages
- Figure SD-3: VX1.5/VX2 Transmitter - Control/Monitor Stage
- Figure SD-4: VX1.5 Transmitter - Ac and RF Power Stages
- Figure SD-5: NAPI189 Analog Audio PWB (Sheet 1 of 2)
- Figure SD-7: NAPI187 System Interface PWB (Sheet 1 of 2)
- Figure SD-8: NAPI187 System Interface PWB (Sheet 2 of 2)
- Figure SD-9: NAPI188/01 Power Supply Interface PWB, 2 kW (VX150/VX300/VX600)
- Figure SD-10: NAPI188 Power Supply Interface PWB, 3.5 kW (VX1/VX1.5/VX2)
- Figure SD-11: NAPI193 Front Panel User Interface PWB
- Figure SD-12: NAPA41 Pre-Amp/IPA PWB
- Figure SD-13: NAPA40 Power Amplifier PWB
- Figure SD-16: NAPH15 2-Way Splitter PWB (VX1.5/VX2)
- Figure SD-6: NAPI189 Analog Audio PWB (Sheet 2 of 2)
- SECTION 3.4: Mechanical Drawings
- Figure MD-1: VX150/VX300/VX600/VX1 Transmitters
- Figure MD-4: NAPI187 System Interface PWB
- Figure MD-5: NAPI188/01 Power Supply Interface PWB (VX150/VX300/VX600)
- Figure MD-11: NAPP15 Directional Coupler PWB
- Figure MD-12: NAPH15 2-Way Splitter PWB (VX1.5/VX2)
- Figure MD-7: NAPI193 Front Panel User Interface PWB
- Figure MD-6: NAPI188 Power Supply Interface PWB (VX1/VX1.5/VX2)
- Figure MD-13: 2-Way Combiner PWB (Nautel Part # PU03A) (VX1.5/VX2)
- Figure MD-8: NAPA41 Pre-Amp/IPA PWB
- Figure MD-9: NAPA40 Power Amplifier PWB
- Figure MD-10: NAPF16 Low Pass Filter PWB
- Figure MD-2: VX1.5/VX2 Transmitter
- Figure MD-3: NAPI189 Analog Audio PWB
- SECTION 3.5: List of terms
- Blank Page
VX150 TO VX2 TROUBLESHOOTING MANUAL RESPONDING TO ALARMS
VERSION 0.1 2020-12-01 PAGE 3.1.3
Electrostatic Protection
The transmitter's assemblies contain semiconductor devices that are susceptible to damage from
electrostatic discharge. The following precautions must be observed when handling an assembly which
contains these devices.
Electrical Discharging of Personnel
Personnel should be electrically discharged by a suitable grounding system (e.g., anti-static mats,
grounding straps) when removing an assembly from the transmitter, and while handling the assembly
for maintenance procedures.
Handling/Storage
An assembly should be placed in an anti-static bag when it is not installed in a host transmitter, or
when it is not undergoing maintenance. Electronic components should be stored in anti-static
materials.
Tools/Test Equipment
Testing and maintenance equipment – including soldering and unsoldering tools – should be suitable
(i.e., grounded tip) for contact with static sensitive semiconductor devices.
Stress Current Protection
Every precaution should be taken to ensure the static sensitive semiconductor devices are protected
from unnecessary stress current. This is achieved by ensuring that current is not flowing when an
electrical connection is broken, and that voltages are not present on external control/monitoring circuits
when they are connected.
CAUTION! Electrostatic energy is produced when two insulating materials are
rubbed together. A person wearing rubber-soled shoes, walking across a nylon
carpet or a waxed floor, can generate an extremely large electrostatic charge. This
effect is magnified during periods of low humidity. Semiconductor devices such as
integrated circuits, field-effect transistors, thyristors and Schottky diodes may be
damaged by this high voltage unless adequate precautions are taken.