Datasheet

Intel® Xeon® Processor E5-2400 v2 Product Family 10
Datasheet Volume One
5-2 Digital Thermal Sensor Specification Summary.................................................... 103
5-3 Embedded Case Temperature Thermal Specifications ........................................... 105
5-4 Embedded DTS Thermal Specifications............................................................... 106
6-1 Memory Channel DDR1, DDR2, DDR3................................................................. 115
6-2 Memory Channel Miscellaneous ......................................................................... 116
6-3 PCI Express* Port 1 Signals.............................................................................. 116
6-4 PCI Express* Port 3 Signals.............................................................................. 116
6-5 PCI Express* Miscellaneous Signals ................................................................... 117
6-6 DMI2 and PCI Express Port 0 Signals ................................................................. 117
6-7 Intel QPI Port Signals....................................................................................... 118
6-8 Intel QPI Miscellaneous Signals ......................................................................... 118
6-9 PECI Signals................................................................................................... 118
6-10 System Reference Clock (BCLK) Signals ............................................................. 118
6-11 JTAG and TAP Signals ...................................................................................... 119
6-12 SVID Signals .................................................................................................. 119
6-13 Processor Asynchronous Sideband Signals .......................................................... 119
6-14 Miscellaneous Signals ...................................................................................... 122
6-15 Power and Ground Signals................................................................................ 123
7-1 Power and Ground Lands.................................................................................. 127
7-2 SVID Address Usage........................................................................................ 130
7-3 VR12.0 Reference Code Voltage Identification (VID) Table .................................... 130
7-4 Signal Description Buffer Types......................................................................... 132
7-5 Signal Groups................................................................................................. 132
7-6 Signals with On-Die Termination ....................................................................... 135
7-7 Power-On Configuration Option Lands ................................................................ 135
7-8 Fault Resilient Booting (Output Tri-State) Signals ................................................ 136
7-9 Processor Absolute Minimum and Maximum Ratings............................................. 137
7-10 Storage Condition Ratings ................................................................................ 138
7-11 Voltage Specification........................................................................................ 139
7-12 Processor Supply Current Specifications ............................................................. 140
7-13 Processor VCC Static and Transient Tolerance ..................................................... 140
7-14 VCC Overshoot Specifications............................................................................ 143
7-15 DDR3 and DDR3L Signal DC Specifications.......................................................... 144
7-16 PECI DC Specifications..................................................................................... 146
7-17 System Reference Clock (BCLK{0/1}) DC Specifications ....................................... 146
7-18 SMBus DC Specifications .................................................................................. 147
7-19 JTAG and TAP Signals DC Specifications ............................................................. 147
7-20 Serial VID Interface (SVID) DC Specifications...................................................... 147
7-21 Processor Asynchronous Sideband DC Specifications ............................................ 148
7-22 Miscellaneous Signals DC Specifications.............................................................. 148
7-23 Processor I/O Overshoot/Undershoot Specifications ............................................. 154
7-24 Processor Sideband Signal Group Overshoot/Undershoot Tolerance........................ 155
8-1 Land Name..................................................................................................... 157
8-2 Land Number.................................................................................................. 175
9-1 Processor Loading Specifications ....................................................................... 198
9-2 Package Handling Guidelines............................................................................. 198
9-3 Processor Materials.......................................................................................... 199
10-1 PWM Fan Frequency Specifications For 4-Pin Active Thermal Solution ..................... 212
10-2 PWM Fan Characteristics for Active Thermal Solution............................................ 212
10-3 PWM Fan Connector Pin and Wire Description...................................................... 213
10-4 Processor Thermal Solution Boundary Conditions................................................. 214