Datasheet

Intel® Xeon® Processor E5-2400 v2 Product Family 100
Datasheet Volume One
Thermal Management Specifications
5.1.2 T
CASE
and DTS Based Thermal Specifications
To simplify compliance to thermal specifications at processor run time, the processor
has added a Digital Thermal Sensor (DTS) based thermal specification. Digital Thermal
Sensor reports a relative die temperature as an offset from TCC activation
temperature. T
CASE
thermal based specifications are used for heat sink sizing and DTS
based specs are used for acoustic and fan speed optimizations. For the processor
family, firmware (for example, BMC or other platform management devices) will have
DTS based specifications for all SKUs programmed by the customer. Some SKUs at a
sharing the same TDP may share a common T
CASE
thermal profile but they will have
separate T
DTS
based thermal profiles.
The processor fan speed control is managed by comparing DTS thermal readings via
PECI against the processor-specific fan speed control reference point, or Tcontrol. Both
Tcontrol and DTS thermal readings are accessible via the processor PECI client. At a
one time readout only, the Fan Speed Control firmware will read the following:
• TEMPERATURE_TARGET MSR
• Tcontrol via PECI - RdPkgConfig()
• TDP via PECI - RdPkgConfig()
• Core Count - RdPCIConfigLocal()
DTS PECI commands will also support DTS temperature data readings. Please see
Section 2.5.7, “DTS Temperature Data” for PECI command details.
Also, refer to the
Intel® Xeon® Processor E5-2400 v2 Product Family
Thermal/Mechanical Design Guide (TMDG) for details on DTS based thermal solution
design considerations.