Datasheet

Intel® Xeon® Processor E5-2400 v2 Product Family 104
Datasheet Volume One
5.1.4 Embedded Server Thermal Profiles
Network Equipment Building System (NEBS) is the most common set of environmental
design guidelines applied to telecommunications equipment in the United States.
Embedded server SKU’s target operation at higher case temperatures and/or NEBS
thermal profiles for embedded communications server and storage form factors. The
term “Embedded” is used to refer to those segments collectively. Thermal profiles in
this section pertain only to those specific Embedded SKU’s.
The Nominal Thermal Profile must be used for standard operating conditions or for
products that do not require NEBS Level 3 compliance.
The Short-Term Thermal Profile may only be used for short-term excursions to higher
ambient operating temperatures, not to exceed 96 hours per instance, 360 hours per
year, and a maximum of 15 instances per year, as intended by NEBS Level 3. Operation
at the Short-Term Thermal Profile for durations exceeding 360 hours per year violate
the processor thermal specifications and may result in permanent damage to the
processor.
Implementation of the defined thermal profile should result in virtually no TCC
activation. Refer to the
Intel® Xeon® Processor E5-2400 v2 Product Family Thermal/
Mechanical Design Guide (TMDG) for system and environmental implementation
details.
5.1.4.1 Embedded operating case temperature thermal profiles
Thermal Design Power (TDP) should be used for processor thermal solution design
targets. TDP is not the maximum power that the processor can dissipate. TDP is
measured at specified maximum T
CASE
.
Power specifications are defined at all VID values found in Table 7-3. The Intel® Xeon®
processor E5-2400 v2 product family may be delivered under multiple VIDs for each
frequency. Implementation of a specified thermal profile should result in virtually no
TCC activation. Failure to comply with the specified thermal profile will result in
increased probability of TCC activation and may incur measurable performance loss.
Refer to the
Intel® Xeon® Processor E5-2400 v2 Product Family Thermal/Mechanical
Design Guide (TMDG)
for system and environmental implementation details.
Each case temperature thermal profile is unique to each TDP and core count
combination. These T
CASE
profiles are fully defined by the simple linear equation:
T
CASE
= PSI
CA
* P + T
LA
Where:
PSI
CA
is the Case-to-Ambient thermal resistance of the processor thermal solution.
T
LA
is the Local Ambient nominal temperature.
P is the processor power dissipation.
The Short-Term thermal profile provides for a 15°C rise of temperature above the
nominal profile due to scenarios such as fan failure or A/C failure. Short-term
excursions to higher ambient operating temperatures are strictly limited 96 hours per
instance, 360 hours per year, and a maximum of 15 instances per year as intended by
NEBS Level 3.
T
LA-ST
designates the Local Ambient temperature for Short-Term operation.