Datasheet

Intel® Xeon® Processor E5-2400 v2 Product Family 105
Datasheet Volume One
Table 5-3 provides the PSI
CA
and T
LA
parameters that define T
CASE
thermal profile for
each TDP/Core count combination. Figure 5-3 illustrates the general form of the
resulting linear graph resulting from
T
CASE
= PSI
CA
* P + T
LA
.
5.1.4.2 Embedded Digital Thermal Sensor (DTS) thermal profiles
The thermal solution is expected to be developed in accordance with the Tcase thermal
profile. Operational compliance monitoring of thermal specifications and fan speed
modulation may be done via the DTS based thermal profile.
Each DTS thermal profile is unique to each TDP and core count combination. These
T
DTS
profiles are fully defined by the simple linear equation:
T
DTS
= PSI
PA
* P + T
LA
Where:
PSI
PA
is the Processor-to-Ambient thermal resistance of the processor thermal solution.
Table 5-3.
Embedded Case Temperature Thermal Specifications
TDP (W)
Core
Count
T
LA
(°C) T
LA-ST
(°C)
PSI
CA
(°C/W)
Minimum
T
CASE
(°C)
Nominal
Maximum
T
CASE
(°C)
Short-Term
Maximum
T
CASE
(°C)
LV70W-10C 10 50.0 65.0 0.383 5.0 76.8 91.8
LV60W-8C 8 52.0 67.0 0.369 5.0 74.1 89.1
LV60W-6C (1S) 6 52.0 67.0 0.383 5.0 75.0 90.0
LV50W-6C 6 52.0 67.0 0.505 5.0 77.2 92.2
LV40W-2C (1S) 2 52.0 67.0 0.612 5.0 76.5 91.5
Figure 5-3. Embedded Case Temperature Thermal Profile