Datasheet

Intel® Xeon® Processor E5-2400 v2 Product Family 13
Datasheet Volume One
Overview
1 Overview
1.1 Introduction
Datasheet - Volume One provides DC specifications, land and signal definitions, and an
overview of additional processor feature interfaces.
This document is intended to be distributed as a part of a document set. The structure
and scope of the volumes are provided in Table 1-2.
The Intel® Xeon® processor E5-2400 v2 product family is the next generation of 64-
bit, multi-core enterprise processors built on 22-nanometer process technology.
Throughout this document, the Intel® Xeon® processor E5-2400 v2 product family
may be referred to as simply the processor. Based on the low-power/high performance
processor microarchitecture, the processor is designed for a two-chip platform as
opposed to the traditional three-chip platforms (processor, MCH, and ICH). The two-
chip platform consists of a processor and the Platform Controller Hub (PCH) and
enables higher performance, easier validation, and improved x-y footprint.
The Intel® Xeon® processor E5-2400 v2 product family is designed for server,
embedded and storage applications.
This processor features one Intel® QuickPath Interconnect point-to-point link capable
of up to 8.0 GT/s, up to 24 lanes of PCI Express* 3.0 links capable of 8.0 GT/s, and 4
lanes of DMI2/PCI Express* 2.0 interface with a peak transfer rate of 5.0 GT/s. The
processor supports up to 46 bits of physical address space and 48-bit of virtual address
space.
Included in this family of processors is an integrated memory controller (IMC) and
integrated I/O (IIO) (such as PCI Express* and DMI2) on a single silicon die. This single
die solution is known as a monolithic processor.
Table 1-1. Code Name to Product Family Name
Code Name Product Family
IVB-EN Intel® Xeon® processor E5-2400 v2 product family
Table 1-2. Volume Structure and Scope (Sheet 1 of 2)
Volume 1: Electrical, Mechanical and Thermal Specification
•Overview
•Interfaces
• Technologies
• Power Management
• Thermal Management Specifications
• Signal Descriptions
• Electrical Specifications
• Processor Land Listing
• Package Mechanical Specifications