Datasheet

Intel® Xeon® Processor E5-2400 v2 Product Family 138
Datasheet Volume One
Electrical Specifications
2. Overshoot and undershoot voltage guidelines for input, output, and I/O signals are outlined in
Section 7.9.5. Excessive overshoot or undershoot on any signal will likely result in permanent damage to
the processor.
7.7.1 Storage Condition Specifications
Environmental storage condition limits define the temperature and relative humidity
limits to which the device is exposed to while being stored in a Moisture Barrier Bag.
The specified storage conditions are for component level prior to board attach (see
notes in Table 7-10 for post board attach limits).
Table 7-10 specifies absolute maximum and minimum storage temperature limits which
represent the maximum or minimum device condition beyond which damage, latent or
otherwise, may occur. The table also specifies sustained storage temperature, relative
humidity, and time-duration limits. These limits specify the maximum or minimum
device storage conditions for a sustained period of time. At conditions outside sustained
limits, but within absolute maximum and minimum ratings, quality & reliability may be
affected.
Notes:
1. Storage conditions are applicable to storage environments only. In this scenario, the processor must not
receive a clock, and no lands can be connected to a voltage bias. Storage within these limits will not affect
the long-term reliability of the device. For functional operation, please refer to the processor case
temperature specifications.
2. These ratings apply to the Intel component and do not include the tray or packaging.
3. Failure to adhere to this specification can affect the long-term reliability of the processor.
4. Non-operating storage limits post board attach: Storage condition limits for the component once attached
to the application board are not specified. Intel does not conduct component level certification assessments
post board attach given the multitude of attach methods, socket types and board types used by customers.
Provided as general guidance only, Intel board products are specified and certified to meet the following
temperature and humidity limits (Non-Operating Temperature Limit: -40C to 70C & Humidity: 50% to 90%,
non condensing with a maximum wet bulb of 28C).
5. Device storage temperature qualification methods follow JEDEC High and Low Temperature Storage Life
Standards: JESD22-A119 (low temperature) and JESD22-A103 (high temperature).
7.8 DC Specifications
DC specifications are defined at the processor pads, unless otherwise noted.
DC specifications are only valid while meeting specifications for case temperature
(T
CASE
specified in Section 5), clock frequency, and input voltages. Care should be
taken to read all notes associated with each specification.
Table 7-10. Storage Condition Ratings
Symbol Parameter Min Max Unit
T
absolute storage
The minimum/maximum device storage temperature
beyond which damage (latent or otherwise) may
occur when subjected to for any length of time.
-25 125 °C
T
sustained storage
The minimum/maximum device storage temperature
for a sustained period of time.
-5 40 °C
T
short term storage
The ambient storage temperature (in shipping media)
for a short period of time.
-20 85 °C
RH
sustained storage
The maximum device storage relative humidity for a
sustained period of time.
60% @ 24 °C
Time
sustained storage
A prolonged or extended period of time; typically
associated with sustained storage conditions
Unopened bag, includes 6 months storage time by
customer.
0 30 months
Time
short term storage
A short period of time (in shipping media). 0 72 hours